The synergistic effect of irregular alumina and round plates boron nitride binary‐particle system on the thermal conductivity of epoxy composites

Abstract

As the main encapsulation material, epoxy resin has an urgent need to obtain higher thermal conductivity. So how to improve the thermal conductivity of epoxy resin is very important. In this work, a novel strategy is proposed that the irregular alumina (i-Al 2 O 3 ) and the round plate boron nitride (h-BN) are integrated into epoxy resin to enhance the thermal conductivity. When the total amount of filler is 40%, and the volume ratio of auxiliary filler h-BN and the basic filler i-Al 2 O 3 is 6: 34，The thermal conductivity of the epoxy composites is significantly increased 709% higher than that of pure epoxy resin. The roles of the main filler i-Al 2 O 3 and the auxiliary filler h-BN in epoxy composites system were investigated. A possible mechanism was established that the h-BN connects i-Al 2 O 3 to generate the heat conduction network. The blending of irregular particles and round plate method proposed in this work is a new avenue, which meets the need of industrialized design and fabricating, making an achievement of obtaining a kind of epoxy composites with a high thermal conductivity and excellent comprehensive properties.

Spherical boron nitride/pitch‐based carbon fiber/silicone rubber composites for high thermal conductivity and excellent electromagnetic interference shielding performance

“…Various thermally conductive fillers such as metals, ceramics and carbon materials have been extensively studied over the past decades. [7][8][9] Among them, carbon materials, including carbon nanotubes (CNTs), graphene, carbon fiber, and so forth, have received great attention recently because of their lightweight advantage over the metal or ceramic counterparts. [10][11][12] Beyond that, due to the sp 2 hybridization of carbon atoms, these carbon materials generally possess good electrical conductivity, thus endowing the corresponding composites with excellent EMI shielding performance.…”