2006
DOI: 10.1016/j.mssp.2006.01.024
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The surface topography of GaN grown on Si (111) substrate before and after wet chemical etching

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Cited by 7 publications
(2 citation statements)
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“…At this initial stage of etching process, the defective region at grain boundaries, which contains weak atomic bonds, will be readily etched by the KOH solution. 18,19 For 30 minutes etched sample (Fig. 2c), the pore density increases as more small pores are observed and distributed across the sample.…”
Section: Resultsmentioning
confidence: 98%
“…At this initial stage of etching process, the defective region at grain boundaries, which contains weak atomic bonds, will be readily etched by the KOH solution. 18,19 For 30 minutes etched sample (Fig. 2c), the pore density increases as more small pores are observed and distributed across the sample.…”
Section: Resultsmentioning
confidence: 98%
“…It indicates that the surface morphologies of the film had been greatly influenced by etching time. Owing to a significant lattice mismatch between ZnO and Al 2 O 3 (18.4%), ZnO films deposited on Al 2 O 3 contain large quantity of dislocation [14], and the etching operation occurring at the dislocation and boundary was preferable [19]. The etching rate along boundary was faster than that in the grain, as a result, the surface morphologies become rougher and rougher with the increasing etching time.…”
Section: Resultsmentioning
confidence: 99%