The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate

T., H.; Wang, J.; Qu, Lin; An, Lili; Gu, L. Y.; Huang, Mingliang

doi:10.1109/icept-hdp.2012.6474634

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Wettability Of the Investigated Samples1

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2016

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“…The as-extruded SAC307 samples presented slightly lower average contact angles than those found for the directionally solidified alloy sample, achieving relatively close q a values between each other. According to the literature [32] the uniform chemical composition of the rapidly-solidified Sn-0.7 wt%Cu alloy may improve its wettability if compared with as-cast alloy (slow cooling conditions). Furthermore, the freezing range of the rapidlysolidified Sn-0.7 wt%Cu alloy tends to be narrow, which would help to uniform melt.…”

Section: Wettability Of the Investigated Samplesmentioning

confidence: 99%