2020
DOI: 10.3390/cryst10080712
|View full text |Cite
|
Sign up to set email alerts
|

The Study of High Breakdown Voltage Vertical GaN-on-GaN p-i-n Diode with Modified Mesa Structure

Abstract: In this paper, we fabricated Gallium Nitride (GaN) vertical p-i-n diodes grown on free-standing GaN (FS-GaN) substrates. This homogeneous epitaxy led to thicker GaN epi-layers grown on the FS-GaN substrate, but a high crystalline quality was maintained. The vertical GaN p-i-n diode showed a low specific on-resistance of 0.85 mΩ-cm2 and high breakdown voltage (BV) of 2.98 kV. The high breakdown voltage can be attributed to the thick GaN epi-layer and corresponds to the mesa structure. Improvement of the device … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(2 citation statements)
references
References 36 publications
0
2
0
Order By: Relevance
“…Therefore, in the remainder of the work, polarization losses are called dielectric losses for simplicity. These losses depend mainly on electrical permittivity, pulsation, the dielectric loss coefficient, and, above all, on electric field stress, which is a function of, among others, voltage [29].…”
Section: No-load Lossesmentioning
confidence: 99%
“…Therefore, in the remainder of the work, polarization losses are called dielectric losses for simplicity. These losses depend mainly on electrical permittivity, pulsation, the dielectric loss coefficient, and, above all, on electric field stress, which is a function of, among others, voltage [29].…”
Section: No-load Lossesmentioning
confidence: 99%
“…It causes intensive investigation of their design, technology, and features, carried out by both by industry and university research teams. The studies focus on different design concepts such as vertical [1][2][3], lateral [4,5] or 3D core-shell [6][7][8][9] devices, discussing their fabrication technologies [10][11][12], or aiming at their features employing experimental [13,14] or numerical [15][16][17] approaches.…”
Section: Introductionmentioning
confidence: 99%