2023
DOI: 10.1016/j.vacuum.2023.111888
|View full text |Cite
|
Sign up to set email alerts
|

The sputtering performance of Ag sputtering targets with different microstructure

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

1
0
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(2 citation statements)
references
References 26 publications
1
0
0
Order By: Relevance
“…The 2D and 3D AFM images presented in Figure 5a-e show the effect of thickness and Ag incorporation on the surface topography. The AFM analyses showed the same characteristic observed in the SEM analyses already presented and those reported in previous studies [31,32], where a more intense distribution of particulates is noted at high deposition rates. The results are compatible with those of studies presented in the literature The agglomeration of particulates promoted by the increase in the Ag evaporation rate promotes an increase in the root mean square roughness caused by silver segregation on the surface.…”
Section: The Roughness-rms and Thickness Of Tin-ag Coatingssupporting
confidence: 87%
“…The 2D and 3D AFM images presented in Figure 5a-e show the effect of thickness and Ag incorporation on the surface topography. The AFM analyses showed the same characteristic observed in the SEM analyses already presented and those reported in previous studies [31,32], where a more intense distribution of particulates is noted at high deposition rates. The results are compatible with those of studies presented in the literature The agglomeration of particulates promoted by the increase in the Ag evaporation rate promotes an increase in the root mean square roughness caused by silver segregation on the surface.…”
Section: The Roughness-rms and Thickness Of Tin-ag Coatingssupporting
confidence: 87%
“…Therefore, the Ni 3+ content was adjusted to achieve the optimal conditions of improved transmittance, resistivity, crystallinity, and mobility. With regard to adjusting the properties of thin films, recent vacuum studies report various techniques such as sputtering targets with different microstructures, decreasing the heating rate, co-sputtering, and post-annealing [21][22][23][24].…”
Section: Of 21mentioning
confidence: 99%