The Solubility of Polyimides in Polar Aprotic Solvents

Suleiman-Rosado, David; Hinkley, Jeffrey A.

doi:10.1177/095400830201400308

Cited by 3 publications

References 10 publications

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Polyimides

Bryant

2006

Kirk-Othmer Encyclopedia of Chemical Technology

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Polyimides are a class of high performance polymers that contain an imide group, defined as an sp 3 nitrogen bonded to two adjacent carbonyls. This imide structure is most commonly found as part of a five or six membered ring. Aromatic polyimides are noted for their mechanical properties, chemical resistance and dielectric strength. They exist as thermoplastics and thermosets and are available in many formats. Polyimides are used as hot melt adhesives, matrix resins for composites, dielectric films, photoimageable coatings, flex circuits, foams, wire insulation, thin walled tubing, molding resins and high performance bushings and seals. Products that compete with polyimides for niche applications include aerospace epoxies (Dow, Ciba and Shell), cyanate resins (Dow), polysulfones (Solvay), filled polycarbonates and polyesters (Dow, Amoco and GE), polybenzimidazoles (Hoechst‐Celanese) and some high Tg filled phenolics. Although polyimides command a premium price, their versatility, reliability, and demonstrated performance makes them suitable use in high performance applications where failure and replacement costs are high.

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Polyimides

Bryant

2006

Kirk-Othmer Encyclopedia of Chemical Technology

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show abstract

Polyimides

Bryant¹

2006

Encyclopedia of Polymer Science and Technology

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Polyimides are a class of high performance polymers that contain an imide group, defined as an sp 3 nitrogen bonded to two adjacent carbonyls. This imide structure is most commonly found as part of a five‐ or six‐membered ring. Aromatic polyimides are noted for their mechanical properties, chemical resistance, and dielectric strength. They exist as thermoplastics and thermosets and are available in many formats. Polyimides are used as hot melt adhesives, matrix resins for composites, dielectric films, photoimageable coatings, flex circuits, foams, wire insulation, thin‐walled tubing, molding resins, and high performance bushings and seals. Products that compete with polyimides for niche applications include aerospace epoxies (Dow, Ciba, and Shell), cyanate resins (Dow), polysulfones (Solvay), filled polycarbonates and polyesters (Dow, Amoco, and GE), polybenzimidazoles (Hoechst‐Celanese), and some high T g ‐filled phenolics. Although polyimides command a premium price, their versatility, reliability, and demonstrated performance makes them suitable use in high performance applications where failure and replacement costs are high.

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