2004
DOI: 10.1016/j.jcrysgro.2004.06.009
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The solidification of Al–Cu binary eutectic alloy with electric fields

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Cited by 20 publications
(7 citation statements)
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“…For directionally solidified Al-Cu eutectic alloy, electric field increased the lamellar spacing and the number of laminates. [14] However, contrary results under DC of 1136 A cm À2 were obtained by Gu et al [15] Here, it should be pointed out that most of the attention has been paid to investigate the effect of current intensity on the microstructure modification of alloys, and the potential mechanism of current treatment appears to be inconsistent and controversial. Various explanations for current treatment have been proposed, such as the increase in the solid-liquid interfacial energy, [16] the suppression of grain growth due to Joule heating, [13] current crowding due to the differing electrical conductivities of solid and liquid, [2] electromigration, [10] melt flow caused by Lorentz force, [2] and the reduction in the nucleation activation energy.…”
Section: Introductionmentioning
confidence: 85%
“…For directionally solidified Al-Cu eutectic alloy, electric field increased the lamellar spacing and the number of laminates. [14] However, contrary results under DC of 1136 A cm À2 were obtained by Gu et al [15] Here, it should be pointed out that most of the attention has been paid to investigate the effect of current intensity on the microstructure modification of alloys, and the potential mechanism of current treatment appears to be inconsistent and controversial. Various explanations for current treatment have been proposed, such as the increase in the solid-liquid interfacial energy, [16] the suppression of grain growth due to Joule heating, [13] current crowding due to the differing electrical conductivities of solid and liquid, [2] electromigration, [10] melt flow caused by Lorentz force, [2] and the reduction in the nucleation activation energy.…”
Section: Introductionmentioning
confidence: 85%
“…Recently, DC of the order of 10 1–2 A cm –2 was applied to modify the microstructures of alloys. Liu et al 11 reported that electric fields increased the lamellar spacing and the number of laminates of directionally solidified Al–Cu eutectic alloy due to enhancement of atom diffusion in liquid. However, the lamellar spacing was decreased by DC of 1136 A cm –2 .…”
Section: Introductionmentioning
confidence: 99%
“…The experimental results show that external electric field can be used to control the alloy's microstructure. However, most of the observed phenomena were explained based merely on the influence of the electric field on the vacancies [5][6][7]. The influence of an electric field on thermodynamic properties has received minimal attention [8].…”
Section: Introductionmentioning
confidence: 99%