Abstract:The vacuum eutectic solder joint is widely used in the advantages of large thermal conductivity, small thermal resistance and so on. But the void ratio of vacuum eutectic solder has a great influence on the thermal conductivity, and the smaller the void ratio is, the greater the thermal conductivity coefficient is. Therefore, it is very necessary to optimize the parameters of vacuum eutectic welding process and reduce the void ratio of solder joints. In this paper, the three-dimensional finite element simulati… Show more
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