“…4,5 In essence and in the case of oxides, it has been shown that breakdown could be delayed by introducing impurities, whose nature and concentrations meet specific requirements, or by achieving a microstructure that favors to some degree the spreading of charges. [6][7][8][9][10][11][12] Indeed, it contributes to the improvement of component reliability of industrial devices, for instance in thin insulating systems as those used in plasma display panels, 13 spacecraft insulating, 14 alumina rf-window, 15 power electronic capacitors, 16 high-k materials of metal-oxidesemiconductor structures, 17 and field emission display spacers. [6][7][8][9][10][11][12] Indeed, it contributes to the improvement of component reliability of industrial devices, for instance in thin insulating systems as those used in plasma display panels, 13 spacecraft insulating, 14 alumina rf-window, 15 power electronic capacitors, 16 high-k materials of metal-oxidesemiconductor structures, 17 and field emission display spacers.…”