The Role of Σ9 Boundaries in Grain Boundary Engineering

Randlè, Valerie; Coleman, Mark; Waterton, M.

doi:10.1007/s11661-010-0302-7

Cited by 25 publications

(9 citation statements)

References 17 publications

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“…More importantly, fractions of Σ9 + Σ27 increased from 3.4% (AR) to 10.2% (ARGBE). An increase in the Σ9, Σ27 fractions has been attributed to the Σ3 regeneration model proposed by Randle et al [32,33]. In addition, triple junction fractions extracted from the orientation maps show a sharp drop in fraction of J0 type from 48% to 10%.…”

Section: Microstructurementioning

confidence: 77%

Surface grain boundary engineering of Alloy 600 for improved resistance to stress corrosion cracking

Telang

Gill²,

Tammana

et al. 2015

Materials Science and Engineering: A

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In this paper, we demonstrate a novel method for grain boundary engineering in Alloy 600 using iterative cycles of ultrasonic nanocrystal surface modification (UNSM) and strain annealing to modify the near surface microstructure (~ 250 µm) for improved stress corrosion cracking (SCC) resistance. These iterative cycles resulted in increased fraction of special grain boundaries whilst decreasing the connectivity of random grain boundaries in the altered near surface region. A disrupted random grain boundary network and a large fraction of low CSL boundaries (Σ3-Σ27) reduced the propensity to sensitization. Slow strain rate tests in tetrathionate solutions at room temperature show that surface GBE lowered susceptibility to intergranular SCC. Detailed analysis of cracks using Electron Back-scattered Diffraction showed cracks arrested at J1(1-CSL) and J2 (2-CSL) type of triple junctions. The probability

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Section: Microstructurementioning

confidence: 77%

Surface grain boundary engineering of Alloy 600 for improved resistance to stress corrosion cracking

Telang

Gill²,

Tammana

et al. 2015

Materials Science and Engineering: A

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“…In this context, GBs − specifically the energy of GBs − has been explored as a way to make a material more thermally stable and resistant to crack nucleation: As random high‐angle GBs (HAGBs) and their conjunctions are often prone to crack nucleation, one approach is to enhance the fraction of coincidence site lattice (CSL)‐GBs, with low

normalΣ

, which relates to their relatively low excess energy . Of special interest are

normalΣ

3‐GBs, with a specific interest in the triple junction (TJ) that these GBs are part of . For instance, Kobayashi et al observed no intergranular fatigue cracks at TJs consisting only of

normalΣ

‐GBs …”

Section: The Selected Annealing Temperatures (Isochronal Annealing) Umentioning

confidence: 99%

Characterization of Special Grain Boundaries and Triple Junctions in Cu_xNi_1‐x Alloys upon Deformation and Annealing

Emeis¹,

Leuthold²,

Spangenberg³

et al. 2019

Adv Eng Mater

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We compare two quantities to describe a microstructure: the length fraction of normalΣ3/normalΣ9‐grain boundaries and the number fraction of normalΣ3‐x‐x/normalΣ3‐normalΣ3‐normalΣ9‐triple junctions using Cu, Ni and four of their alloys in several microstructural states. The fractions of normalΣ3‐grain boundaries show similar tendencies as the respective fractions of normalΣ3‐x‐x‐triple junctions in relation to the grain size upon deformation and annealing. However, the fraction of normalΣ9‐grain boundaries stagnates at certain grain sizes, while there is still a considerable change of normalΣ3‐normalΣ3‐normalΣ9‐triple junctions during grain growth, meaning that the normalΣ3‐normalΣ3‐normalΣ9‐triple junction microstructure is still evolving. To analyze the evolution of the triple junction microstructure, a program, such as pythorient, is necessary.

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Section: Introductionmentioning

confidence: 99%

“…CSL boundaries are characterized by misorientations that allow atoms from neighboring lattices to 2 Journal of Materials coincide notionally [11]. The fraction of atoms that coincide at the boundary is called the density of coincidence sites [11]. The reciprocal of this density of the coinciding sites is used to describe a CSL boundary and is designated as Σ [12,13].…”

Section: Introductionmentioning

confidence: 99%

Influence of Grain Boundary Character and Annealing Time on Segregation in Commercially Pure Nickel

Welsh

Kapoor

Underwood

et al. 2016

Journal of Materials

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Commercially pure nickel (Ni) was thermomechanically processed to promote an increase in Σ3 special grain boundaries. Engineering the character and chemistry of Σ3 grain boundaries in polycrystalline materials can help in improving physical, chemical, and mechanical properties leading to improved performance. Type-specific grain boundaries (special and random) were characterized using electron backscatter diffraction and the segregation behavior of elements such as Si, Al, C, O, P, Cr, Mg, Mn, B, and Fe, at the atomic level, was studied as a function of grain boundary character using atom probe tomography. These results showed that the random grain boundaries were enriched with impurities to include metal oxides, while Σ3 special grain boundaries showed little to no impurities at the grain boundaries. In addition, the influence of annealing time on the concentration of segregants on random grain boundaries was analyzed and showed clear evidence of increased concentration of segregants as annealing time was increased.

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The Role of Σ9 Boundaries in Grain Boundary Engineering

Cited by 25 publications

References 17 publications

Surface grain boundary engineering of Alloy 600 for improved resistance to stress corrosion cracking

Surface grain boundary engineering of Alloy 600 for improved resistance to stress corrosion cracking

Characterization of Special Grain Boundaries and Triple Junctions in Cu_xNi_1‐x Alloys upon Deformation and Annealing

Influence of Grain Boundary Character and Annealing Time on Segregation in Commercially Pure Nickel

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The Role of Σ9 Boundaries in Grain Boundary Engineering

Cited by 25 publications

References 17 publications

Surface grain boundary engineering of Alloy 600 for improved resistance to stress corrosion cracking

Surface grain boundary engineering of Alloy 600 for improved resistance to stress corrosion cracking

Characterization of Special Grain Boundaries and Triple Junctions in CuxNi1‐x Alloys upon Deformation and Annealing

Influence of Grain Boundary Character and Annealing Time on Segregation in Commercially Pure Nickel

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Characterization of Special Grain Boundaries and Triple Junctions in Cu_xNi_1‐x Alloys upon Deformation and Annealing