The Role of Inorganic Fillers in Electrostatic Discharge Composites

Abstract

The occurrence of uncontrolled electrostatic discharge (ESD) is among the major causes of damage in unprotected electronic components during industrial processes. To counteract this undesired phenomenon, ESD composites showing static-dissipative and antistatic responses are developed. In particular, static-dissipative materials are able to slow down the flow of electric charges, whereas antistatic materials directly suppress the initial charges induced by undesired charging by properly dispersing conductive fillers within an insulant matrix and thus forming a conductive filler network. In this context, the purpose of this review is to provide a useful resume of the main fundamentals of the technology necessary for facing electrostatic charging. The formation mechanisms of electrostatic charges at the material surface were described, providing a classification of ESD composites and useful characterization methods. Furthermore, we reported a deep analysis of the role of conductive fillers in the formation of filler networks to allow electric charge movements, along with an overview of the different classes of inorganic conductive fillers exploitable in ESD composites, evidencing pros/cons and criticalities of each category of inorganic fillers.

SiO2@Al2O3 binary filler: A chance for enhancing the heat transport in rubber composites for tire applications

“…Polymers and polymer composites are materials largely used in several aspects of our daily life and large-scale industrial applications (e.g., automotive and aeronautics, (opto)electronics, photonics, biomedical devices, packaging industry, ESD protective systems, and so on) due to their intrinsic properties, namely: easy manufacturing and processing, design freedom, lightweight, excellent water/ corrosion resistance, relatively low cost, etc. [1][2][3][4][5][6][7][8][9][10] Unfortunately, these outstanding properties are coupled with an intrinsic low thermal conductivity (k) deriving from the polymeric matrix, typically 0.1-0.5 W m À1 K À1 at room temperature (RT). 11,12 Hence, heat dissipation remains one of the major problems affecting the thermal stability of these materials, which limits their in-service life and performances, especially in the case of systems working under dynamic service conditions, such as rubber composites for tires.…”

“…Polymers and polymer composites are materials largely used in several aspects of our daily life and large‐scale industrial applications (e.g., automotive and aeronautics, (opto)electronics, photonics, biomedical devices, packaging industry, ESD protective systems, and so on) due to their intrinsic properties, namely: easy manufacturing and processing, design freedom, lightweight, excellent water/corrosion resistance, relatively low cost, etc 1–10 . Unfortunately, these outstanding properties are coupled with an intrinsic low thermal conductivity ( k ) deriving from the polymeric matrix, typically 0.1–0.5 W m −1 K −1 at room temperature (RT) 11,12 .…”

Surface Modification of Copper-Based Flakes for Conductive Polymer Composites

“…), ceramic fillers (BN, TiC, MXene, etc.) and metal-coated fillers (with or without a metal core) [ 6 ]. The insulating polymer matrix in CPCs offers flexibility, low cost, low density, corrosion resistance and high specific strength, as well as the production of complex shapes through various environmentally friendly technologies, such as 3D printing [ 7 , 8 , 9 , 10 ], injection molding [ 11 ] and compression molding [ 12 ].…”