The Role of Electrolyte Composition on Codeposited Ag and Cu

Abstract

The eutectic Ag-Cu composition is a common brazing alloy. A complex ion bath containing KAg(CN)2, CuCN, KCN and K4P2O7 was used to codeposit Ag and Cu. The effects of KAg(CN)2, KCN and K4P2O7 concentrations on the composition and morphology of electrodeposited Ag-Cu films was investigated in this study. A constant CuCN concentration of 0.1 M was used. The increase in KCN and KAg(CN)2 concentrations caused major increases in Ag contents, but increase in K4P2O7 concentration caused a minor decrease in Ag content of the film. The deposits were found to be globular clusters when high KAg(CN)2 concentrations were used. Finer microstructures and higher Ag contents were observed in deposits produced in electrolytes containing higher KCN concentrations.

Effects of Pulse Electroplating Parameters on Return Loss (S11) and Surface Roughness of Silver Coatings

“…A typical cell used during silver electroplating can be seen elsewhere [18]. A solution containing only potassium and silver cyanide salts was used for this pulse plating.…”