The role of dynamic recrystallization in [001] single-crystal W and W-Ta alloy ballistic rod penetration into steel targets

Pizaña, C.; Esquivel, E. V.; Murr, L. E.; Piña, C. Y.; Baquera, M. T.; Anchondo, I.A.; Magness, Lee S.

doi:10.1007/s10853-005-2021-9

Cited by 5 publications

(1 citation statement)

References 11 publications

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“…In parallel, one finds a very large number of reports of dynamic recrystallization (DRX) observed in the broken ASB in numerous metals. [6,[8][9][10][11][12][13][14][15][16] This observation is again justified in terms of the high temperature inside the band. A contradictory observation was reported by Rittel et al [17] for annealed Ti6AL4V, by which the authors observed dynamically recrystallized grains in specimens that had not failed and were only loaded to roughly half their failure strain by ASB.…”

Section: Introductionmentioning

confidence: 89%

Microstructural Aspects of Adiabatic Shear Failure in Annealed Ti6Al4V

Landau

Venkert²,

Rittel

2009

Metall Mater Trans A

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This work reports a comprehensive examination of the microstructural evolution in Ti6Al4V subjected to high-strain-rate deformation. The sequence of microstructural rearrangements leading to adiabatic shear banding is presented. A detailed microstructural comparison between two types of specimens, one that failed by adiabatic shear and the other that was strained to half its failure strain, is carried out. The main observation is that for this material, the microstructure of the two types of specimens is qualitatively identical, indicating that from approximately half the failure strain until adiabatic shear failure, no additional micromechanism is observed to develop and operate. Overall, the microstructure undergoes a significant refinement with the increasing strain until the formation of dynamically recrystallized grains. It is therefore suggested that the evolution of the volume fraction of recrystallized grains should be characterized from its early onset until final failure by adiabatic shear banding.

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