The relationship of life prediction between cyclic bending and thermal cycle testing on CSP package

Chang, Graver; Yu, Chi-Ko; Shao, Tina; Chen, Cherie; Lee, Jeffrey; Huang, Austin; Lin, Jay; Hsieh, Casanova

doi:10.1109/impact.2010.5699623

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference 2010

DOI: 10.1109/impact.2010.5699623

|View full text |Cite

The relationship of life prediction between cyclic bending and thermal cycle testing on CSP package

Graver Chang

Chi-Ko Yu

Tina Shao

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2011

2013

Publication Types

Select...

Other3

Relationship

Self Cite0

Independent3

Authors

Journals

Cited by 3 publications

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

Mechanical properties of Sn-Bi bumps on flexible substrate

Kim

Yoo

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

View full text Add to dashboard Cite

The future electronics will be flexible, bendable, and wearable device. The damages like thermal stress and warpage occurred generally during bonding process between flexible substrate and chip used Pb-free solder for wearable electronic device. Though the wearable electronic devices have been researched, there is few study on bonding technology and reliability of joint between chip with solder bump and flexible substrate. In this study, we investigated joint properties of eutectic Sn-58Bi solder bump formed on flexible substrate finished with ENIG by flip chip process. The Si chip with Sn-58Bi solder bumps and Cu pillar bumps for interconnection were formed by electroplating method. The diameter and height of Sn-58Bi bumps were 25um and 16um, respectively. The Sn-58Bi solder bumps were bonded on flexible substrate at the conditions of bonding temperature of 170°C, bonding time for 15sec, and bonding pressure of 1N, 2N, and 3N. The Si chip and flexible substrate have been designed to daisy chain for measurement of electric resistance. After flip chip bonding, we observed crosssectioned images by SEM. The Cu 6 Sn 5 IMC was formed at the Cu pillar bump side and Ni 3 Sn 4 IMC was formed at the ENIG substrate side. And then, the thermal reliability of joints was evaluated by thermal shock test. The test conditions were in the range or -40°C to 105°C and dwell time for 15min. After thermal shock test, we observe that crack initiated between Cu 6 Sn 5 IMCs and Sn-Bi solder and then propagated within Sn-Bi solder and/or in interface between IMCs and solder. And we also evaluated reliability of bending fatigue. We observed that failure occurred at Ni 3 Sn 4 IMCs/solder and in solder matrix after bending test

show abstract

Mechanical properties of Sn-Bi bumps on flexible substrate

Kim

Yoo

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

View full text Add to dashboard Cite

show abstract

Experimentally validated analysis and parametric optimization of monotonic 4-point bend testing of advanced BGA packages

Wang

Xie

Ahmad

2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

View full text Add to dashboard Cite

Oxygenous reflow affecting performance of Pb-free TFBGA assembly

Shih

Chen

Lee

et al. 2011

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

View full text Add to dashboard Cite

More high-pin count package and thinner thickness of ball-gridarray (BGA) substrate are appreciated in the recent commercial electronic products. Using thin profile fine-pitch BGA (TFBGA) substrate incorporated into the assembly line is a feasible solution.To expose the possibility with this substrate, two species of lead-free solder balls with and without nickel were applied and the oxygen concentration impacting the solder quality in reflow process was considered. The flux assistance for solderability was adopted to verify the integration capability in assembly mass production. The temperature effect attacking the solder adhesion due to the thermal stress and the difference of thermal expansion coefficients for entire package products was also taken into concern. Using the shear test and drop test could clarify the solder adherence between solder ball and TFBGA carrier substrate. Finally, the Cpk values for all of test groups were greater than 1.33, which demonstrated the TFBGA substrate was suitable to be employed in the high-pin count and highprofit electronic products.

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

The relationship of life prediction between cyclic bending and thermal cycle testing on CSP package

Cited by 3 publications

References 1 publication

Mechanical properties of Sn-Bi bumps on flexible substrate

Mechanical properties of Sn-Bi bumps on flexible substrate

Experimentally validated analysis and parametric optimization of monotonic 4-point bend testing of advanced BGA packages

Oxygenous reflow affecting performance of Pb-free TFBGA assembly

Contact Info

Product

Resources

About