The Rapid Boiling of Thin Liquid Films with Different Thicknesses on Nanochannel Copper Plates: A Molecular Dynamics Study

Abstract

Boiling heat transfer on nanostructured surfaces presents great potential in cooling highly integrated microelectronic devices. Analysis of the factors affecting boiling heat transfer included the analysis of nanostructure and wettability, indicating that consideration of the influence of working liquid quantity is essential in finite spaces. Rapid boiling water films with various thicknesses placed on the same nanochannel copper plate were studied via molecular dynamics (MD) simulations. The simulation results reveal that the potential energy difference in the vapor–liquid coexisting region on the nanochannels was lower for thicker films, and the evaporation rate was lower. The effect of water film thickness on boiling heat transfer is closely related to the potential energy difference in the vapor–liquid coexisting region on the nanochannels. The heat transfer effect was the worst in case 1, where the water thickness was lower than the height of the nanochannels. This is because there is no guaranteed liquid replenishment at the nucleation points, although the potential energy difference was greatest in the vapor–liquid coexistence zone of case 1. Evaporation was the greatest in case 2, where the water film just covered the nanochannels because of the larger potential energy difference and sufficient liquid water replenishment. This study is of great significance for the analysis of the vapor–liquid flow mechanisms of micro/nanostructured surfaces and the improved design of thermal management equipment of micro/nano devices.