The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment

Low Temperature Deposition of Cu Thin Film on Polyimide Using RF-driven Atmospheric Pressure Plasma Jet in Nitrogen Atmosphere

“…As we reported in previous paper [6], the deposition rate is an important factor for future industrial application of this method. The formation of copper films in polyimide films was previously reported in the case of vacuum evaporation of copper onto a fully cured polyimide substrate at an elevated temperature and lower deposition rate [13][14][15].…”

“…Yang et al deposited Copper films on 10 cm×10 cm polyimide substrates by RF magnetron sputter system and intermittent growth technique, and the deposition rate was about 2.11 nm/s at 500 W [13]. Noh et al evaluated that the deposition rate of the Cu sputtering system was 0.33 nm/s, respectively, for both the Ni-Cr and Cu sputtering [14].…”

“…Polyimide (PI) has good thermal stability, chemical-stability and mechanical properties such as a high modulus of elasticity. Accordingly, copper (Cu) coated PI films are commonly used as flexible printed circuit boards in the electronic industry [1][2][3]. To meet the growing needs for patterning of precise fine circuits in future, we developed a technique to deposit Cu thin film on polyimide by employing atmospheric pressure plasma (APP) jet driven by radiofrequency (RF) power.…”

Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene

“…There are several studies in the literature on bonding polymers. In these studies, the adhesion interface conditions are modified in order to evaluate the influence on the joint strength [5][6][7][8][9]. The surface cleaning technique of ions spray on the piece was reported by [10], who observed the influence of pre-treatment applied in the titanium films on polymeric substrates.…”

The Effect of Hydroxy Ethyl Cellulose (HEC) and Chloride Ions on the Surface Morphology and Mechanical Characteristics during Copper Electrodeposition

“…Many researches have aimed at increasing the adhesion strength of interfaces between layers. 1,[3][4][5][6][7][8][9] To plate a layer of copper foil on the substrate, various deposition techniques have been used including electrodeposition, CVD, PVD, sputtering, and thermal evaporation. Among these techniques, electroplating is the most commercially important process because it is timeefficient and cost-effective without the need for the vacuum system that is required for sputtering and thermal evaporation techniques.…”