The preparation of transmission electron microscopy specimens of as-drawn gold wire

Noguchi, Kunihiro; Araki, M; Ohno, Yasuhide

doi:10.1016/s1359-6462(00)00391-2

Cited by 9 publications

(5 citation statements)

References 7 publications

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“…It has already been reported that gold wire has mechanical property anisotropy because it has a different Young's modulus depending on the crystal direction [19,20]. The Young's modulus of each orientation is calculated based on the following equation.…”

Section: Methodsmentioning

confidence: 99%

Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

et al. 2011

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Inhomogeneous microtexture evolution during the cold drawing process usually results in lean, sway, or sweep failure. The <111> longitudinal fiber texture has higher stiffness than the <100> texture and its proportion and distribution in the cross-section are critical for the bonding stability of fine gold wire. We investigated the inhomogeneous microtexture evolution of gold wire that was cold drawn through an asymmetric diamond die. In this study, the distributions of the <111> and <100> textures in a 20 μm diameter fine gold wire are the variables and their effects on the bonding stability of the wire were estimated by electron backscattered diffraction (EBSD) and finite element method (FEM) simulations. The use of a focused ion beam apparatus enabled a high quality of band contrast of the EBSD to be achieved in the exact half cross-sectional area of the fine gold wire. The detailed three-dimensional FEM results show that the asymmetric distribution of the textures plays a crucial role in increasing the spatial displacement of the gold bonding wire.

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Section: Methodsmentioning

confidence: 99%

Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire

et al. 2011

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“…TEM specimen was prepared with the microtome. 14,15) Figure 2 shows shear curves of 37Pb ball bonding tested at the shear height Z = 0 µm. Figures 2(a), (b) and (c) indicate the results of reflow cooling rates 200 K/min, 100 K/min and 10 K/min, respectively.…”

Section: Methodsmentioning

confidence: 99%

Influence of Shear Height on Shear Strength of Tin-Lead Solder Ball Bonding

et al. 2002

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The crack generation energy U 1 and the crack progress energy U 2 of eutectic Sn-37 mass%Pb solder ball and Sn-36 mass%Pb-2 mass%Ag one were surveyed by the shear test. Both balls were bonded at various reflow cooling rates (10-200 K/min). The shear test was carried out under the condition of two kinds of the shear height, Z = 0 µm and Z = 200 µm. U 1 and U 2 were calculated by multiplying the shear strength by the shear distance. Though U 2 was independent on the cooling rate, the ball composition and the shear height, U 1 changed depending on these parameters. Only U 1 of Sn-36 mass%Pb-2 mass%Ag ball bonding cooled at 200 K/min dropped sharply though U 1 of both ball bonding was almost the same and increased with the faster cooling rates in case of Z = 0 µm. U 1 of Sn-36 mass%Pb-2 mass%Ag ball bonding was higher than that of the eutectic ball at each cooling rate as a result of the shear test at Z = 200 µm. The needle shape Ag 3 Sn intermetallic compound in Sn-36 mass%Pb-2 mass%Ag ball and near the interface contributed mainly to the lower U 1 at Z = 0 µm because Ni 3 Sn 4 reaction layer formed at 200 K/min was thin. The higher U 1 at Z = 200 µm was due to the fine lamellar structure (Sn phase/Pb phase) in Sn-36 mass%Pb-2 mass%Ag ball. The shear property of the same ball depended on the shear height in the present study.

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“…14 But some details must be improved to adapt the techniques to special metal wires. K. Noguchi et al reported two methods to prepare thin specimens with a drawn direction cross-section (D. D. cross-section) and wire cross-section (T. D. cross-section), 15 respectively. There are two challenges that have to be overcome in NiCr thin sample preparation.…”

Section: Introductionmentioning

confidence: 99%