The preparation of pH-sensitive Pd catalyst ink for selective electroless deposition of copper on a flexible PET substrate

Wang, Po-Chiang; Chang, Chang-Pin; Youh, Meng-Jey; Liu, Yih-Ming; Chu, Chung Ming; Ger, Ming-Der

doi:10.1016/j.jtice.2015.10.024

Cited by 20 publications

(3 citation statements)

References 50 publications

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“…In order to use an ink on a substrate, the ink has to present adhesion onto the substrate. Photo paper and PET substrates are largely used as substrates for flexible electronics 9,11,13,15,[34][35][36][37][38][39] ; since PET showed lower ink adhesion values than photo paper for the inks developed in this work, printing tests were performed only on photo paper.…”

Section: Resultsmentioning

confidence: 99%

Silver nanoparticle conductive inks: synthesis, characterization, and fabrication of inkjet-printed flexible electrodes

Fernandes

Aroche

Schuck

et al. 2020

Sci Rep

173

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Flexible electronics can be developed with a low-cost and simple fabrication process while being environmentally friendly. Conductive silver inks have been the most applied material in flexible substrates. This study evaluated the performance of different conductive ink formulations using silver nanoparticles by studying the material properties, the inkjet printing process, and application based on electrical impedance spectroscopy using a buffer solution. Silver nanoparticles synthesis was carried out through chemical reduction of silver nitrate; then, seven conductive ink formulations were produced. Properties such as resistivity, viscosity, surface tension, adhesion, inkjet printability of the inks, and electrical impedance of the printed electrodes were investigated. Curing temperature directly influenced the electrical properties of the inks. The resistivity obtained varied from 3.3 × 10 0 to 5.6 × 10 −06 Ω.cm. Viscosity ranged from 3.7 to 7.4 mPa.s, which is suitable for inkjet printing fabrication. By using a buffer solution as an analyte, the printed electrode pairs presented electrical impedance lower than 200 Ω for all the proposed designs, demonstrating the potential of the formulated inks for utilization in flexible electronic devices for biological sensing applications. Inkjet printing has been investigated as an alternative production tool for the fabrication of conductive elements and devices in the field of flexible electronics. This fabrication technique deposits particles of the material with desirable electrical properties onto a substrate, after which, the printed pattern is converted into conductive elements 1. There are benefits related to the inkjet printing, namely, a simple fabrication process, low cost, reduction of material waste, and excellent adequacy to several substrates 2-4. This printing process involves the storage of ink in a cartridge and the ejection of an exact amount of material through the nozzles 5. Therefore, the fabrication of flexible circuits, sensors, and other printed materials represents a great technological advancement compared with other standard methods, such as drop casting or stamping 6. Silver remains one of the best options for application as a conductive ink and adhesive, compared to other electrically conductive fillers. This is mainly due to its high electrical and thermal conductivity, chemical stability, relatively low cost (compared to gold or graphene, for example), and the ability of its oxide form to conduct electricity 2. Additionally, silver nanoparticles have a low melting point, which promotes the generation of conductive thin films in relatively low temperatures, this is vital to applications in flexible substrates, such polymers and papers 4,7,8. Different methods can be used for the synthesis and stabilization of silver nanoparticles. One of the most popular approaches is chemical reduction, using a variety of organic and inorganic reducing agents 7,9. Depending on the method used silver nanoparticles can be fabricated with different morpholo...

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Section: Resultsmentioning

confidence: 99%

Silver nanoparticle conductive inks: synthesis, characterization, and fabrication of inkjet-printed flexible electrodes

Fernandes

Aroche

Schuck

et al. 2020

Sci Rep

173

View full text Add to dashboard Cite

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“…The as‐deposited palladium nanoparticles facilitate as a catalyst for electroless nickel plating at low operating temperatures . Literature also showed that palladium nanoparticle inks were commonly used as a catalyst for electroless plating of copper on polymer substrates for fabricating flexible electronics. Qin et al demonstrated the fabrication of pH sensors with their synthesized palladium precursor ink and thus implying that palladium nanoparticle inks also have the potential to be used for fabricating pH sensors.…”

Section: Single Element Metallic Nanoparticle Inksmentioning

confidence: 99%

Metallic Nanoparticle Inks for 3D Printing of Electronics

Tan

Chua

et al. 2019

Adv Elect Materials

199

100

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Metallic nanoparticle inks are readily obtainable from the commercial market and are commonly used for fabricating conductive tracks and patterns due to their relatively higher electrical conductivity as compared to other types of inks. These metallic nanoparticle inks are made up of electrically conductive metallic nanoparticles suspended in liquid mediums, with particle size ranging from 1 to 100 nm. However, there are also diverse types of metallic nanoparticle inks in the market (for instance, silver nanoparticle inks, gold nanoparticle inks, and copper nanoparticle inks). Metallic nanoparticle inks of different material compositions can directly influence the final electrical, material, and mechanical properties of the printed patterns. This paper presents an overview of the different types of metallic nanoparticle inks used for the 3D printing of electronics. The strengths and weaknesses of each type of ink are critically reviewed. The challenges and potentials of metallic nanoparticle inks in 3D printed electronics are also discussed. Metallic Nanoparticle InksMetallic nanoparticle inks are suspensions of metallic nanoparticles in liquid mediums (see Figure 2a), in which individual metallic nanoparticle is encapsulated in a layer of insulating organic additives and stabilizing agents (see Figure 2b). The encapsulating organic additives and stabilizing agents help prevent the metallic nanoparticles from agglomeration, but at the same time, also impede the flow of electrons from particles to particles. Therefore, sintering processes are required to remove The three-dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commonly used for fabricating conductive tracks and patterns due to their relatively high electrical conductivity as compared to other types of inks, and they can be further categorized into single-element metallic nanoparticle inks, alloy metallic nanoparticle inks, metallic oxide nanoparticle inks, and core-shell bimetallic nanoparticle (BNP) inks. It is critical to gain a deep understanding of the metallic nanoparticle inks used in 3D printed electronics as the material properties of these inks can directly affect the final electrical and mechanical properties of the printed patterns. This review presents an overview of the available metallic nanoparticle inks used for 3D printing of electronics, and critically reviews the strengths and weaknesses of each type of ink. Finally, the challenges of metallic nanoparticle inks in 3D printed electronics are also discussed along with the future outlook for 3D printed electronics.

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“…The conventional pretreatment process mainly includes the four steps of cleaning, coarsening, sensitization, and activation, and the activation is an important step to determine the catalytic activity of the substrate [ 29 , 30 , 31 ]. The activation of the fibers often uses palladium with high reactivity, such as the sensitization–activation two-step method [ 32 , 33 , 34 ], the colloidal palladium activation method [ 35 , 36 ], the liquid ion palladium activation method [ 37 , 38 ], and so on. Due to the highly toxic and expensive nature of palladium, as well as the great potential of polluting the plating layer [ 39 , 40 ], these types of methods are not conducive to the preparation and application of the electroless silver-plated fibers.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Conductive Polyester Fibers Using Continuous Two-Step Plating Silver

Liu

et al. 2018

Materials

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Polyester fibers are used in various fields, due to their excellent mechanical and chemical stability. However, the lack of conductivity limits their application potential. In order to prepare conductive polyester fibers, silver is one of the most widely used materials to coat the surface of the fibers. This work aimed to prepare silver-coated polyester fibers by a continuous two-step method, which combined the operations of continuous electroless plating and electroplating. Meanwhile, we designed specialized equipment for the continuous plating of silver on the polyester fibers under a dynamic condition. The mechanical property, washability, electrical resistivity, and electrical conductivity of the resultant conductive polyester fibers obtained from different silver-plating conditions were also characterized. The results demonstrated that the conductive fibers prepared by continuous two-step silver plating equipment, had good electrical conductivity with better mechanical properties and washability.

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The preparation of pH-sensitive Pd catalyst ink for selective electroless deposition of copper on a flexible PET substrate

Cited by 20 publications

References 50 publications

Silver nanoparticle conductive inks: synthesis, characterization, and fabrication of inkjet-printed flexible electrodes

Silver nanoparticle conductive inks: synthesis, characterization, and fabrication of inkjet-printed flexible electrodes

Metallic Nanoparticle Inks for 3D Printing of Electronics

Preparation of Conductive Polyester Fibers Using Continuous Two-Step Plating Silver

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