The Nucleation, Growth, and Structure of Thin Ni-P Films

Abstract

The nucleation, early growth, and structure of Ni‐P on SnCl2‐PdCl2 activated dielectric substrates were studied. The SnCl2‐PdCl2 treatment was found to provide small catalytic sites on the substrate, serving as the nuclei for Ni‐P growth. The average diameter of catalytic sites was estimated to be less than 10Aå. The microscopic time rate of Ni‐P growth on the nuclei was found to be constant and the growth to be isotropic. The resulting Ni‐P deposit in the early stages of growth consists of circular islands. The surface density σ of islands were affected by activation. In later stages of growth, the circular Ni‐P islands merged to form a continuous film. The critical film thickness at which continuity is attained is shown to be a function of σ. The structure of as‐deposited islands, as well as that of fresh continuous film, was determined by electron diffraction to be liquidlike.

Synthesis of nickel nanoparticles supported on metal oxides using electroless plating: Controlling the dispersion and size of nickel nanoparticles

“…The plating occurs by the reduction of nickel ions at the surface of the active substrate immersed into the plating solution and continues to deposit on the substrate through a catalytic action of the deposit itself [7][8][9]. Two mechanisms of electroless plating with borohydride as reductant have been reported by Gorbunova (Scheme S1) and Mallory (Scheme S2) [5,6,[10][11][12][13]. Three routes for the activation of electroless nickel plating are proposed based on the two mechanisms and the work of Hwang and Lin as shown in Fig.…”

Electroplating on crystalline polypropylene. I. Compression molding and adhesion

“…The above results clearly show that (1) cooling rate, (2) nature of the mold surface, and (3) after-plated annealing affect peel adhesion values. If morphology is important for adhesion, then the relationship of these variables to surface structure should be demonstrable.…”

Electroless and Immersion Plating Process towards Structures and IMC Formation

“…Currently, electroless nickel process at low and medium phosphorus level has a mixture amorphous and microcrystalline nickel. While, the structure will be fully amorphous when the phosphorus content is high [7,35,36] as showing in Fig. 1.…”