The nature of the charges, currents, and fields in and about conductors having cross-sectional dimensions of the order of a skin depth

Matthaei, G.L.; Kiziloglu, K.; Dagli, N.; Long, S.I.

doi:10.1109/22.57327

Cited by 30 publications

(7 citation statements)

References 4 publications

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“…The charge density ρ and the current density J are nonzero only in the conducting walls; as far as the dielectric is concerned, their effects are supplanted by boundary conditions. In accordance with the traditional analysis, we presume that the skin depth can be taken to be zero (valid for superconductors at all frequencies, perfect conductors at all nonzero frequencies, and good conductors at sufficiently high frequencies; this assumption has been explored in depth in Matthaei et al (1990), so next to a conducting wall with normal n pointing into the dielectric we have (see Balanis, 1989;Collin, 1991Collin, , 1992Harrington, 1961;Jackson, 1962;Jones, 1989;Kraus, 1984;Panofsky & Phillips, 1962;Ramo, Whinnery, & Van Duzer, 1965;Sadiku, 1994) D normal = surface charge density, E tangential = 0;…”

Section: Governing Equationsmentioning

confidence: 94%

On the Remarkable Accuracy of the Quasi-Static TEM Approximation for Distributed Network Models

Snider

Gardner

2004

Electromagnetics

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Section: Governing Equationsmentioning

confidence: 94%

On the Remarkable Accuracy of the Quasi-Static TEM Approximation for Distributed Network Models

Snider

Gardner

2004

Electromagnetics

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“…Also, it is assume that the lateral dimensions of the CPW, 2(WϩG) is much less than g /2 allowing a quasi-TEM approximation [4,5]. The ground planes are suggested to be extended to infinity and the dielectric layers with low losses or being lossless.…”

Section: Multi-layered Substrate Analysis By Conformal Mappingmentioning

confidence: 99%

“…q i is the filling factor. Equation (5) indicates that the total effective dielectric constant is the sum of the dielectric constant of each layer multiplied by the filling factor. In other words, the filling factor is a measure of the proportionality of electromagnetic energy inside each layer.…”

Section: Multi-layered Substrate Analysis By Conformal Mappingmentioning

confidence: 99%

Tunable (Ba, Sr)TiO₃ interdigital capacitor onto Si wafer for reconfigurable radio

Kim

Yun

Lee

et al. 2007

Micro & Optical Tech Letters

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In this article, the potential feasibility of integrating BST films into Si wafer by adopting tunable interdigital capacitor (IDC) with TiO2 thin film buffer layer is suggested. TiO2 as buffer layer is grown onto Si substrate by atomic layer deposition and the coplanar IDC on BaxSr1−xTiO3(500 nm)/TiO2(50 nm)/high resistivity Si (HR‐Si) is fabricated. BST interdigital tunable capacitors integrated on HR‐Si substrate with high tunability and low loss tangent are characterized for their microwave performances. BST/HR‐Si and BST/TiO2/HR‐Si IDCs show much enhanced tunability values of 31% and 40%, respectively as compared to the value of 21% obtained with BST film on MgO single crystal substrate at the bias of 5 kV/cm. BST/TiO2/HR‐Si structure shows much improved figure of merit of 504.4 as compared to 418.53 and 101.68 of BST/MgO and BST/HR‐Si structure, respectively. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 2144–2148, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22657

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“…A quasi-TEM mode is assumed to be the only mode to propagate down the waveguides [6], and the dielectric is assumed to have negligible losses. These assumptions allow the waveguides to be modeled as transmission lines with per-unit length series resistance, series inductance, and shunt capacitance.…”

Section: Numerical Calculationsmentioning

confidence: 99%

The interdigital coplanar waveguide: a new low-impedance micromachinable planar structure

Thompson¹,

Rogers²

1998

IEEE Microw. Guid. Wave Lett.

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This letter describes a new type of coplanar waveguide (CPW) which we call interdigital coplanar waveguide (ICPW). ICPW has three advantages over CPW. First, ICPW can have a lower characteristic impedance for the same minimum feature size and overall line width. Second, at low impedances it can obtain reduced high-frequency resistive loss. Finally, thickening the conductor reduces the ohmic losses more rapidly in the ICPW than in the CPW. This letter presents an analysis comparing CPW and ICPW assuming a TEM mode of propagation. Calculations are performed using finite-element analysis, and volume filament and surface ribbon methods.

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The nature of the charges, currents, and fields in and about conductors having cross-sectional dimensions of the order of a skin depth

Cited by 30 publications

References 4 publications

On the Remarkable Accuracy of the Quasi-Static TEM Approximation for Distributed Network Models

On the Remarkable Accuracy of the Quasi-Static TEM Approximation for Distributed Network Models

Tunable (Ba, Sr)TiO₃ interdigital capacitor onto Si wafer for reconfigurable radio

The interdigital coplanar waveguide: a new low-impedance micromachinable planar structure

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The nature of the charges, currents, and fields in and about conductors having cross-sectional dimensions of the order of a skin depth

Cited by 30 publications

References 4 publications

On the Remarkable Accuracy of the Quasi-Static TEM Approximation for Distributed Network Models

On the Remarkable Accuracy of the Quasi-Static TEM Approximation for Distributed Network Models

Tunable (Ba, Sr)TiO3 interdigital capacitor onto Si wafer for reconfigurable radio

The interdigital coplanar waveguide: a new low-impedance micromachinable planar structure

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Tunable (Ba, Sr)TiO₃ interdigital capacitor onto Si wafer for reconfigurable radio