The mechanism of the crosslinking of epoxide resins by amines

Smith, I. Trevor

doi:10.1016/0032-3861(61)90010-6

Cited by 326 publications

(133 citation statements)

References 28 publications

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“…We discuss now the composite peak that appears in the non-isothermal scan of TGAP/DDS, which can be deconvoluted into two separate exothermic peaks by means of the PeakFit program (PF version v4, Jandel Scientific software, Systat Software Inc., San Jose, California, USA). Similar observations were made by Frigione and Calò [33], who found a pronounced shoulder in the last part of the dynamic exotherm peak, which they attributed to 'diffusional processes taking place at higher conversions', and which they were unable to fit using an autocatalytic model based upon the Equation (7) [35,36]: (7) where k 1 and k 2 represent the temperature dependent rate coefficients for the reaction catalysed by proton donors initially present in the system and those that are produced during cure, respectively. Here, the fit obtained using the asymmetric double sigmoidal function (ADL) shows quite good agreement with the experimental data, a typical example being shown in Figure 3 for a heating rate of 10°C/min.…”

Section: Results and Discussion 41 Dsc Study Of The Tgap/dds Systemsupporting

confidence: 81%

Non-isothermal cure and exfoliation of tri-functional epoxy-clay nanocomposites

Shiravand¹,

Hutchinson

Solé³

2015

Express Polym. Lett.

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Abstract. The non-isothermal cure kinetics of polymer silicate layered nanocomposites based on a tri-functional epoxy resin has been investigated by differential scanning calorimetry. From an analysis of the kinetics as a function of the clay content, it can be concluded that the non-isothermal cure reaction can be considered to consist of four different processes: the reaction of epoxy groups with the diamine curing agent; an intra-gallery homopolymerisation reaction which occurs concurrently with the epoxy-amine reaction; and two extra-gallery homopolymerisation reactions, catalysed by the onium ion of the organically modified clay and by the tertiary amines resulting from the epoxy-amine reaction. The final nanostructure displays a similar quality of exfoliation as that observed for the isothermal cure of the same nanocomposite system. This implies that the intra-gallery reaction, which is responsible for the exfoliation, is not significantly inhibited by the extra-gallery epoxy-amine cross-linking reaction.

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Section: Results and Discussion 41 Dsc Study Of The Tgap/dds Systemsupporting

confidence: 81%

Non-isothermal cure and exfoliation of tri-functional epoxy-clay nanocomposites

Shiravand¹,

Hutchinson

Solé³

2015

Express Polym. Lett.

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“…[9] When an equal reactivity of primary and secondary amine hydrogens is assumed (i.e., absence of the substitution effect), the reaction proceeds via both a non-catalyzed reaction and a reaction catalyzed by initial impurities present in the system and by the hydroxyl groups generated during the reaction:…”

Section: Full Papermentioning

confidence: 99%

Modeling the Cure of an Epoxy‐Amine Resin with Bisphenol A as an External Catalyst

Perrin

Nguyen

Vernet

2007

Macro Chemistry & Physics

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The cure kinetics of a DGEBF/DGEBA mixture with a commercial aliphatic amine mixture [poly(propylene) oxide diamine D230 and diethylene triamine (DETA)] was investigated by DSC. Two types of kinetic models based upon the formation of amine‐epoxy‐hydroxyl transition complex without or with fast pre‐equilibria have been tested and discussed. The mechanistic model with pre‐equilibria was based on the existence of two different epoxy‐hydroxyl complexes namely one involving hydroxyl groups of BPA and the other, the hydroxyl groups of polymer chains. All the kinetic and thermodynamic parameters have been evaluated and discussed. The results show that the mechanistic model with pre‐equilibria determined from isothermal cure provide a more reasonable fitting of the polymerization kinetics under programmed heating‐rate modes than Horie's model. Moreover, the former kinetic model allows the prediction of changes in the BPA content of the initial formulation with good accuracy.magnified image

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“…However, the growth of a thick interfacial film was not observed if the dip-coating was performed in a nitrogen-purged glove box, which clearly indicates that water vapor, O 2 , or CO 2 plays a critical role in accelerating the kinetics. Water vapor is the likely accelerator, as accelerated cure kinetics in the presence of water vapor has been confirmed previously in studies of bulk epoxies [6]. This arises from the increased reactivity of a hydrogenbonded transition state, in which a water molecule forms a hydrogen bond with the oxygen of the epoxide group.…”

Section: Dip-coatingmentioning

confidence: 55%

Resolving fundamental limits of adhesive bonding in microfabrication.

Hall¹,

Frischknecht²,

Emerson³

et al. 2004

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As electronic and optical components reach the micro-and nanoscales, efficient assembly and packaging require the use of adhesive bonds. This work focuses on resolving several fundamental issues in the transition from macro-to micro-to nanobonding. A primary issue is that, as bondline thicknesses decrease, knowledge of the stability and dewetting dynamics of thin adhesive films is important to obtain robust, void-free adhesive bonds. While researchers have studied dewetting dynamics of thin films of model, non-polar polymers, little experimental work has been done regarding dewetting dynamics of thin adhesive films, which exhibit much more complex behaviors. In this work, the areas of dispensing small volumes of viscous materials, capillary fluid flow, surface energetics, and wetting have all been investigated. By resolving these adhesive-bonding issues, we are allowing significantly smaller devices to be designed and fabricated. Simultaneously, we are increasing the manufacturability and reliability of these devices.4

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The mechanism of the crosslinking of epoxide resins by amines

Cited by 326 publications

References 28 publications

Non-isothermal cure and exfoliation of tri-functional epoxy-clay nanocomposites

Non-isothermal cure and exfoliation of tri-functional epoxy-clay nanocomposites

Modeling the Cure of an Epoxy‐Amine Resin with Bisphenol A as an External Catalyst

Resolving fundamental limits of adhesive bonding in microfabrication.

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