The Mechanics of Gold Beam Leads During Thermocompression Bonding

Dais, J. L.

doi:10.1109/tphp.1976.1135140

Cited by 12 publications

(2 citation statements)

References 7 publications

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“…Dais [53] has calculated the forces on the beam lead system during bonding, and although not explicit in his calculations, it appears that forces high enough to produce beam system degradation may occur during bonding. If so, the devices with poor mechanical integrity could be damaged during the bonding process and predisposed to relatively early field failure.…”

Section: Ae Results From Pulling Beam Leaded Devicesmentioning

confidence: 99%

Nondestructive tests used to insure the integrity of semiconductor devices, with emphasis on acousticemission techniques

Harman¹

1979

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Section: Ae Results From Pulling Beam Leaded Devicesmentioning

confidence: 99%

Nondestructive tests used to insure the integrity of semiconductor devices, with emphasis on acousticemission techniques

Harman¹

1979

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“…Instances of inner lead breaks with TAB during accelerated thermal cycling have been reported in the literature. [18][19][20][21] While certain design considerations have been suggested to minimise inner lead stresses, [22][23][24][25][26] they have dealt primarily with the obvious problems of lead straightness (zig-zag geometries have been proposed) and excessive tape material in the corners (the area of highest stress).…”

Section: Tab Descriptionmentioning

confidence: 99%

A Systematic Evaluation of Factors Influencing TAB Inner Lead Reliability

et al. 1993

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation.ABSTRACT -Reliability evaluations for new electronic components and assemblies regularly require extensive test cycles that are both time consuming and costly. Objectives of such test batteries are to identify failure mechanisms and the relationship between these mechanisms and product design or processing features. Optimisation of these critical factors or process steps results in optimised reliability.Statistically designed experiments can facilitate the optimisation process by minimising the amount of testing needed to identify factors affecting reliability, and by providing insight into how these factors can be specified to ensure optimum product design. Designed experimentation was utilised in this study to look at product design and process factors affecting the reliability of inner leads for tape automated bonding (TAB) components. Four factors are considered: outer lead compliancy; chip immobilisation; downset; and tape stiffness and rigidity.Experimental details and results are presented which assess the relative importance of these factors in determining ultimate inner lead reliability, and also provide guidance for final product design considerations.

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Bonding Techniques

Agajanian¹

1979

Microelectronic Packaging

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The Mechanics of Gold Beam Leads During Thermocompression Bonding

Cited by 12 publications

References 7 publications

Nondestructive tests used to insure the integrity of semiconductor devices, with emphasis on acousticemission techniques

Nondestructive tests used to insure the integrity of semiconductor devices, with emphasis on acousticemission techniques

A Systematic Evaluation of Factors Influencing TAB Inner Lead Reliability

Bonding Techniques

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