The mechanical properties of epoxy resins

Yamini, Salim; Young, Robert J.

doi:10.1007/bf00550603

Cited by 143 publications

(47 citation statements)

References 15 publications

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“…29 Si NMR: showed two peaks at -2.89 ppm (H-Si-CH 3 ) and -108.69 ppm (Si-O 4 ). Synthesis of 1,3,5,7,9,11,13,15-octa[dimethylsiloxypropylglycidylether] pentaciclo [9.5.1.1 3,9 .1 5,15 .1 7,13 ] octasilsesquioxane (ODPG) The synthesis of ODPG followed published procedures [19,20,28], as it is described below. A schematic representation of this reaction is showed in the Fig.…”

Section: Synthesis Ofmentioning

confidence: 99%

“…Although thermosetting polymers offer good processibility and relatively low cost compared to metals or ceramics, and good thermal, electrical and mechanical properties, they often face application limitations because they are brittle and have poor resistance to the crack propagation [6,7]. To overcome these drawbacks, many types of polymer-filler composites have been developed, in which the epoxy resins are reinforced with modifying agents, such as fillers, polyhedral oligosilsesquioxanes, dendrimers etc.…”

Section: Introductionmentioning

confidence: 99%

“…29 Si NMR: showed one peak at -99.4 ppm. 1,3,5,7,9,11,13,15-octa[hydridodimethylsiloxy]pentaciclo [9.5.1.1 3,9 .1 5,15 .1 7,13 [19,20,[25][26][27][28], as it is described below.…”

Section: Introductionmentioning

confidence: 99%

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DEA and DSC study of cubic silsesquioxane epoxy resin nanocomposites

Filho

Aquino

2006

E-Polymers

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Non-isothermal dielectric analysis (DEA) and differential scanning calorimetry (DSC) techniques were used to study the epoxy nanocomposites prepared by reacting 1, 3,5,7,9,11,13,15-octa[dimethylsiloxypropylglycidylether] pentaciclo [9.5.1.1 3,9 .1 5,15 .1 7,13 ] octasilsesquioxane (ODPG) with methylenedianiline (MDA). Loss factor (ε") and activation energy were calculated by DEA. The relationships between the loss factor, the activation energy, the structure of the network, and the mechanical properties were investigated. Activation energies determined by DEA and DSC, heat of polymerization, fracture toughness and tensile modulus show the same profile for mechanical properties with respect to ODPG content.

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Section: Synthesis Ofmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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DEA and DSC study of cubic silsesquioxane epoxy resin nanocomposites

Filho

Aquino

2006

E-Polymers

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“…[1][2][3][4][5][6][7] To overcome these drawbacks, many types of polymer-filler composites have been developed, in which the epoxy resins are reinforced with modifying agents, such as fillers, polyhedral oligosilsesquioxanes (POSS), dendrimers etc. [8][9][10][11][12][13][14][15][16][17][18] Polyhedral oligomeric silsesquioxanes (POSS), (RSiO 1.5 ) n with n = 6, 8, 10 ...., are nanoplatforms with 1 to 8 reactive or nonreactive organofunctional groups (R) anchored to the possible eight vertexes of the cubic silsesquioxane.…”

Section: Introductionmentioning

confidence: 99%

Relationship between the dielectric and mechanical properties and the ratio of epoxy resin to hardener of the hybrid thermosetting polymers

Filho¹,

Aquino²,

Pires³

et al. 2006

J. Braz. Chem. Soc.

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Foi investigada a relação entre as propriedades dielétricas (constante dielétrica, ε'; fator de perda, ε"; energia de ativação, E a ) e a proporção de resina epóxi (OG) para endurecedor em polímeros termorrígidos de resina epóxi (OG). A amplitude do pico de ε" decresce com o aumento da porcentagem em massa de OG até aproximadamente 73% e aumenta levemente para maiores % OG. A temperatura da posição do pico de ε" aumenta com o aumento da % OG, alcançando valores máximos para formulações no intervalo de 67 a 73%, e então, decresce acentuadamente para maiores % OG. A energia de ativação obtida por relaxação dielétrica aumentou com a % OG até aproximadamente 70%. Um aumento adicional na % OG até 83% reduz a E a . As curvas das propriedades mecânicas de módulo de tensão e resistência à fratura como função da % em massa de OG apresentaram um comportamento similar.The relationship between the dielectric properties (dielectric constant, ε', and loss factor, ε"; activation energy, E a ) and the ratio of epoxy resin (OG) to hardener of the epoxy resin thermosetting polymers was investigated. The amplitude of the ε" peak decreases with increasing OG content until about 73 wt.% and slightly increases at higher OG content. The temperature of the position of the ε" peak increases with the increasing of OG content, reaching maximum values for compositions in the range of 67 and 73 wt.%, and then it decreases sharply at higher OG content. The activation energy obtained from dielectric relaxation increased with increasing wt.% OG up to around 70 wt.%. Further increase in concentration of OG up to 83 wt.% reduced E a . The curves of tensile modulus and fracture toughness mechanical properties as a function of OG content presented a similar behavior.

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“…[1][2][3][4][5] However, the current problems in engineering applications of epoxy thermosets include poor resistance to crack propagation because they are brittle. 6,7 To overcome brittleness, among other additives of the multi-component formulation of the epoxy resin, a toughening agent is often used, such as fillers, polyhedral oligosilsesquioxanes, dendrimers etc. [8][9][10][11][12][13][14][15][16][17][18] Methods of appropriately mixing two or more different materials, such as inorganic and organic, to obtain a new hybrid material with desirable features have been developed.…”

Section: Introductionmentioning

confidence: 99%

Relationships between the curing conditions and some mechanical properties of hybrid thermosetting materials

Filho¹,

Cardoso²,

Aquino³

2006

J. Braz. Chem. Soc.

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Foi investigada a relação entre os parâmetros calor de polimerização (ΔH) e energia de ativação (E a ) obtidos por calorimetria diferencial de varredura (DSC) e a proporção entre resina epóxi e endurecedor de polímeros termorrígidos baseados em uma resina epóxi híbrida orgânica-inorgânica (OG). A energia de ativação (E a ) e o calor de polimerização (ΔH) aumentaram com o aumento do conteúdo de OG até 70% em massa. Um aumento adicional no conteúdo de OG até 80% reduziu E a e ΔH. A análise dinâmico-mecânica sugere que a máxima densidade de ligações cruzadas é obtida em 83% de OG, enquanto as propriedades mecânicas de resistência à fratura e módulo de tensão são maximizadas em tôrno de 70% de OG.The relationship between the heat of polymerization (ΔH) and activation energy (E a ) parameters, obtained by differential scanning calorimetry (DSC) and the ratio of epoxy resin to hardener of the thermosetting materials based on an organic-inorganic hybrid epoxy resin (OG) was investigated. Activation energy (E a ) and heat of polymerization (ΔH) increased with an increasing OG content, up to 70 wt%. Further increase in OG content to 80wt% reduced E a and ΔH. Dynamic mechanical analysis indicates that the maximum cross-link density is obtained at 83 wt% OG, whereas fracture toughness and tensile modulus mechanical properties are maximized at 70 wt% OG.

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The mechanical properties of epoxy resins

Cited by 143 publications

References 15 publications

DEA and DSC study of cubic silsesquioxane epoxy resin nanocomposites

DEA and DSC study of cubic silsesquioxane epoxy resin nanocomposites

Relationship between the dielectric and mechanical properties and the ratio of epoxy resin to hardener of the hybrid thermosetting polymers

Relationships between the curing conditions and some mechanical properties of hybrid thermosetting materials

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