The mechanical and electrical properties of carbon nanotube‐grafted polyimide nanocomposites

Abstract

Polyimide (PI)‐based nanocomposites containing aminophenyl functionalized multiwalled carbon nanotubes (AP‐MWCNTs) obtained through a diazonium salt reaction was successfully prepared by in situ polymerization. PI composites with different loadings of AP‐MWCNTs were fabricated by the thermal conversion of poly(amic acid) (PAA)/AP‐MWCNTs. The mechanical and electrical properties of the AP‐MWCNTs/PI composites were improved compared with those of pure PI due to the homogeneous dispersion of AP‐MWCNTs and the strong interfacial covalent bonds between AP‐MWNTs and the PI matrix. The conductivity of AP‐MWNTs/PI composites (5:95 w/w) was 9.32 × 10−1 S/cm which was about 1015 times higher than that of Pure PI. The tensile strength and tensile modules of the AP‐MWCNTs/PI composites with 0.5 wt % of AP‐MWCNTs were increased by about 77% (316.9 ± 10.5 MPa) and 25% (8.30 ± 1.10 GPa) compared to those of pure PI, respectively. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014, 52, 960–966

Preparation and electrical properties of polyimide/carbon nanotubes composites

“…However, MWCNTs incorporated in the PI matrix exist as individual tubes or small nanotube bundles. Modified MWCNTs are well dispersed without any obvious aggregation [6,16].…”

Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

“…To address this issue, it is generally effective to introduce functional llers into the polymer matrix. 8,9 Common functional llers include graphene, [10][11][12][13] carbon nanotubes, [14][15][16] boron nitride, 17,18 and metal materials. 19 However, graphene, carbon nanotubes, and metallic materials have high conductivity, dielectric constants and dielectric losses, 16,20,21 which are not suitable for electronic insulation materials and seriously hinder the transmission of electronic signals in electronic packaging materials.…”

“…8,9 Common functional llers include graphene, [10][11][12][13] carbon nanotubes, [14][15][16] boron nitride, 17,18 and metal materials. 19 However, graphene, carbon nanotubes, and metallic materials have high conductivity, dielectric constants and dielectric losses, 16,20,21 which are not suitable for electronic insulation materials and seriously hinder the transmission of electronic signals in electronic packaging materials. Hexagonal boron nitride (h-BN) is a ceramic material with a structure similar to that of a graphene hexagon.…”

Molecular Design and Property Prediction of Sterically Confined Polyimides for Thermally Stable and Transparent Materials

“…Among possible candidates, wholly aromatic polyimides (PIs) have outstanding thermal stability ( T g > 523 K), are mechanically tough, and exhibit high solvent resistance and good electrical properties [7,8,9,10,11,12]. However, they have dark colors (pale yellow to brown) and poor optical transparency in optoelectronic applications [13,14].…”