“…Aside from the well-established techniques to measure the warpage of laminated composites and back calculate the residual stresses (e.g., Barnes & Byerly, 1994;Cowley & Beaumont, 1997;Parlevliet et al, 2007), several During processing Embedded strain gauges (e.g., Crasto, Kim, & Russell, 2002;Kim & Daniel, 2002;Jeronimidis & Parkyn, 1988;Unger & Hansen, 1993;Wisnom, Gigliotti, Ersoy, Campbell, & Potter, 2006) Embedded fiber optic sensors (e.g., Chehura et al, 2005;Leng & Asundi, 2002;Okabe, Yashiro, Tsuji, Mizutani, & Takeda, 2002;Sorensen, Gm€ ur, & Botsis;Zhou & Sim, 2002) Interrupted warpage test (Wisnom, Gigliotti, Ersoy, Campbell, & Potter, 2006) Bi-material beam (BMB) test (Li, Zobeiry, Chatterjee, & Poursartip, 2014) After processing Destructive First ply failure (e.g., Cowley & Beaumont, 1997;Jeronimidis & Parkyn, 1988;Kim & Hahn, 1979;Li et al, 2014) Layer removal (e.g., Chapman, Gillespie, Pipes, Manson, & Seferis, 1990;Crasto & Kim, 1993;Deshpande & Seferis, 1996;Gascoigne, 1994;Joh, Byun, & Ha, 1993) Blind hole drilling (e.g., Cowley & Beaumont, 1997;Jeronimidis & Parkyn, 1988;Ersoy & Vardar, 2000;Parlevliet et al, 2007;Wu & Lu, 2000) Successive grooving (e.g., Ersoy & Vardar, 2000;Parlevliet et al, 2007;Sunderland, Yu, & Manson, 2001) Nondestructive Warpage/Curvature measurement (e.g., Barnes & Byerly, 1994;…”