The cross-linked low-dielectric-constant material has
garnered
much attention in the rapid development of advanced electronics packaging.
However, few studies have systematically explored the effects of cross-linking
density and cross-linking degree on dielectric properties of benzocyclobutene
(BCB)-based polymeric materials. Herein, a series of BCB-based polycarbosiloxanes
with varying cross-linking densities were synthesized through Piers–Rubinsztajn
polycondensation and post-Heck modification. The relationship between
cross-linking behavior and the dielectric characteristics of cured
materials was systematically explored using both molecular dynamics
(MD) simulation and experimental verification. The results revealed
that higher cross-linking density and cross-linking degree resulted
in more microbranched structures, which effectively reduced the dielectric
constant and dielectric loss of the materials. Moreover, high cross-linking
density enhanced the thermal and dimensional stability and enabled
a facile tuning of the mechanical property of the materials. Overall,
our work offered a facile route to realize cross-linking process of
BCB-based polymeric materials by MD simulation and to investigate
the relationship between cross-linking and comprehensive performances,
providing a valuable theoretical and experimental basis for the study
of cross-linked low-dielectric-constant material.