The light behavior from Shallow Trench Isolation profiles at Chemical Mechanical Planarization step and correlation with optical endpoint system by interferometry
Abstract:In the semiconductor manufacturing, the control of Chemical-Mechanical Planarization (CMP) process time for Shallow Trench Isolation (STI) is important. A wafer under-or over-polishing causes leakage and short-circuits making the chips defective. The CMP process control by interferometry is one of the most used systems to monitor the polishing time. In some cases, the interferometry process control is not possible because the wafer patterns cause some unwanted effects such as scattering, diffraction, and absor… Show more
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