1988
DOI: 10.1149/1.2096215
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The Kinetics of Tungsten Etching by Atomic and Molecular Chlorine

Abstract: The reactions of atomic and molecular chlorine with tungsten were studied by modulated beam‐mass spectrometric methods over the temperature range 300–1350 K. The atomic beam was generated by an RF plasma discharge. With both atomic and molecular beams, the main reaction product up to about 1000 K was WCl4 . The reaction probability with atomic chlorine was a factor of approximately ten higher than that obtained with molecular chlorine. The reaction was nonlinear with respect to Cl2 intensity at low beam flu… Show more

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Cited by 20 publications
(9 citation statements)
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“…This difference in the probability to form dissociative adsorbed chlorine on the respective metal surface explains the often observed phenomenon of atomic chlorine showing a much more pronounced attack on molybdenum, tungsten, niobium, and tantalum than molecular chlorine, whereas there is no difference between the two species on nickel surfaces .…”
Section: Reaction Mechanisms Of the High Temperature Chlorination Of mentioning
confidence: 84%
See 1 more Smart Citation
“…This difference in the probability to form dissociative adsorbed chlorine on the respective metal surface explains the often observed phenomenon of atomic chlorine showing a much more pronounced attack on molybdenum, tungsten, niobium, and tantalum than molecular chlorine, whereas there is no difference between the two species on nickel surfaces .…”
Section: Reaction Mechanisms Of the High Temperature Chlorination Of mentioning
confidence: 84%
“…They can be described by the mechanisms of heterogeneous catalysis . According to these theories, the chlorination of the refractory metals tungsten, molybdenum, niobium, and tantalum follows most probably a Rideal‐type of mechanism where the surface is first covered with dissociated chlorine atoms and the chlorine layer is subsequently attacked by further chlorine from the surrounding gas phase .…”
Section: Reaction Mechanisms Of the High Temperature Chlorination Of mentioning
confidence: 99%
“…To develop a mathematical model for the determination of this rate determining step, the single steps have to be defined and their reaction rates mathematically described. The major steps for the formation and removal of a volatile corrosion product from the surface are the following, according to : 1. gas phase diffusion of the chlorine molecule to the metal surface; 2.…”
Section: Mathematical Approachmentioning
confidence: 99%
“…Methods for spontaneous tungsten etching utilize plasmas containing various halogens such as fluorine 27−29 or chlorine. 28,30,31 Tungsten etching occurs through formation of volatile chlorides or fluorides. Tungsten can also be etched by Cl 2 or XeF 2 gases.…”
Section: Introductionmentioning
confidence: 99%