The kinetics of the corrosion of copper containing different amounts of oxygen in 1.7 M H2SO4

Zembura, Z.; Bugajski, Jerzy

doi:10.1016/0010-938x(81)90065-2

Cited by 10 publications

(4 citation statements)

References 7 publications

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“…The corrosion rates (Table) are estimated from the amount of Cu displaced by Pd (Figure, triangles) during a reaction time of 30 s and as expected, it is found that the corrosion rate increases by increasing the PdCl 2 concentration. The corrosion rate values are similar to those obtained in the literature for the corrosion of Cu by oxygen. , In addition, the corrosion rates are also a function of the Pd salt concentration as was the case for the corrosion of Cu by oxygen …”

Section: Resultssupporting

confidence: 87%

Study of the Electroless Deposition of Pd on Cu-Modified Graphite Electrodes by Metal Exchange Reaction

2008

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The electroless deposition of Pd on Cu-modified graphite electrodes using a metal exchange reaction was investigated. The modification procedure consisted in the electrodeposition of Cu on the graphite electrode, subsequently replaced by Pd at open circuit in a Pd-containing solution. The influence of experimental conditions on the exchange reaction rate, the chemical state and the distribution of Cu and Pd on the electrode surface are highlighted. The resulting deposits were studied using cyclic voltammetry, atomic absorption spectroscopy, scanning electron microscopy, energy-dispersive X-ray, and X-ray photoelectron spectroscopy. The last technique confirmed the spontaneous oxidation of Cu by the Pd complexes adsorbed on the electrode surface and also demonstrated that Pd/Cu atomic ratio increases by increasing the PdCl2 concentration. An increase of the Pd electroactive surface area, estimated by cyclic voltammetry, was observed by increasing the initial Cu loading, the exchange reaction time or the PdCl2 concentration. It was also demonstrated that the metal exchange reaction leads to the formation of a Cu core enveloped by a Pd shell for every PdCl2 concentration investigated here. The corrosion rate for the corrosion of copper by a Pd complex was determined and compared with that of the corrosion of copper by oxygen. On the basis of our observations, a general model to describe the Cu−Pd exchange process and the resulting electrode surface composition was proposed.

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Section: Resultssupporting

confidence: 87%

Study of the Electroless Deposition of Pd on Cu-Modified Graphite Electrodes by Metal Exchange Reaction

2008

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“…The results are in agreement with a suggested mechanism that: in aerated acid solutions, the rate determination step during the dissolution of copper is the oxidation of cuprous ion (Cu + ) 18,24,25 , (see Eq.4). The corrosion current density values, calculated according to Tafel extrapolation technique 50 , at different bulk temperatures and various speeds of rotation are given in Table (9).The table shows that the corrosion current density is temperature dependent only, which is in agreement with results of Zembura 19,51 who reported that the corrosion rate of copper in aerated sulfuric acid solution becomes activation controlled at 298 K . The present work was confined to temperature range 283-298K.…”

Section: The Anodic Regionsupporting

confidence: 81%

“…The dissolution reaction of copper in deaerated sulfuric acid solution can be represented [17][18][19][20][21] as:…”

mentioning

confidence: 99%

Corrosion of Copper in Deaerated and Oxygenated 0.1M H2SO4 Solutions under Controlled Conditions of Mass Transfer

Sameh¹,

Salih²,

Alwash³

et al. 2009

ETJ

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The corrosion behavior of copper in deaerated and oxygenated 0.1 H2SO4 solutions has been investigated using the rotating cylinder electrode under turbulent flow conditions. Potentiostatic polarization measurements were carried out at different bulk temperatures of 283, 288, 293 and 298 K and various speeds of rotation viz 100, 200, 300 and 400 r.p.m. The anodic dissolution of copper and the hydrogen evolution reaction, in deaerated and oxygenated solutions, are activation controlled processes dependent on the temperature of the solution. The anodic dissolution of copper is not mass transfer controlled. The results are consistent with a mechanism which suggests that oxidation of copper takes place in two steps of one electron each. The second step, i.e., cuprous ion (Cu+) oxidation, is the rate controlling. Moreover, the mechanism of hydrogen evolution reaction is a proton discharge upon the metal surface. The charge transfer of the oxygen reduction reaction is a 2e process in the range of bulk temperatures employed, i.e., the oxygen reduction is controlled by 2e process. Furthermore, the limiting current density value of the oxygen reduction reaction increases as the velocity of the fluid increases. The results, at a constant bulk temperature are consistent with Eisenberg et al theory for mass transfer to a rotating cylinder electrode surface.

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“…Finally, we compare our findings with an early study of copper electrolyte interface in aqueous medium by Chan et al 20 In this classic work, surface oxide formation was detected in basic/neutral pH conditions, whereas in strongly acidic conditions, the formation Cu-X ͑where X is an anion͒ species was observed. [21][22][23][24] Chan et al observed that even in weakly acidic conditions adsorbed oxygen species, as opposed to oxide formation, were observable in their surface enhanced Raman studies. It is this observation that led us to postulate steps 4a and 4b.…”

Section: Disproportionation ͓4f͔mentioning

confidence: 99%

Copper Thin-Film Dissolution/Precipitation Kinetics in Organic HF Containing Cleaning Solution

Mistkawi

Hussein

Ziomek-Moroz

et al. 2010

J. Electrochem. Soc.

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The corrosion behavior of electrochemically deposited copper thin films in deaerated and non-deaerated commercial cleaning solution containing HF has been investigated. Thin-film copper dissolution and reaction kinetics were investigated by monitoring Cu 2+ , employing inductively coupled plasma-mass spectroscopy, and the oxidation states of copper on Si wafer surface, employing X-ray photoelectron spectroscopy. It was determined that the reaction kinetics is first order with respect to both HF and oxygen concentrations. A kinetic scheme involving reduction of oxygen and oxidation of Cu 0 and Cu 1+ is proposed, which is consistent with the experimentally determined reaction kinetic orders and the observed deposition of undesired copper residues on semiconductor wafers during the cleaning process.

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The kinetics of the corrosion of copper containing different amounts of oxygen in 1.7 M H2SO4

Cited by 10 publications

References 7 publications

Study of the Electroless Deposition of Pd on Cu-Modified Graphite Electrodes by Metal Exchange Reaction

Study of the Electroless Deposition of Pd on Cu-Modified Graphite Electrodes by Metal Exchange Reaction

Corrosion of Copper in Deaerated and Oxygenated 0.1M H2SO4 Solutions under Controlled Conditions of Mass Transfer

Copper Thin-Film Dissolution/Precipitation Kinetics in Organic HF Containing Cleaning Solution

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