The Kinetics of and the Microstructure Induced by the Recrystallization of Copper

Jägle, Eric Aimé; Mittemeijer, E. J.

doi:10.1007/s11661-011-0959-6

Cited by 23 publications

(8 citation statements)

References 40 publications

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“…The migration of boundaries during recrystallization is generally described based on an overall characterization of a given sample, by measuring the stored energy over the whole sample and by averaging the boundary velocity over many recrystallizing boundaries. [31,32] In the present work we have analyzed the local boundary migration following in situ the motion of a single boundary segment and found that there are large variations in the boundary velocity, which represent deviations from a straight line relationship as described in Eq. [1] (see Figure 3), and which cannot be explained by changes in the misorientation characteristics during boundary migration.…”

Section: Discussionmentioning

confidence: 99%

In-Situ Investigation of Local Boundary Migration During Recrystallization

Zhang

Godfrey

Jensen

2014

Metall Mater Trans A

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A combination of electron channeling contrast (ECC) and electron backscatter diffraction pattern (EBSP) techniques has been used to follow in situ the migration during annealing at 323 K (50°C) of a recrystallizing boundary through the deformed matrix of high-purity aluminum rolled to 86 pct reduction in thickness. The combination of ECC and EBSP techniques allows both detailed measurements of crystallographic orientations to be made, as well as tracking of the boundary migration with good temporal resolution. The measured boundary velocity and the local boundary morphology are analyzed based on calculations of local values for the stored energy of deformation. It is found that the migration of the investigated boundary is very complex with significant spatial and temporal variations in its movement, which cannot directly be explained by the variations in stored energies, but that these variations relate closely to local variations within the deformed microstructure ahead of the boundary, and are found related to the local spatial arrangements and misorientations of the dislocation boundaries. The results of the investigation suggest that local analysis, on the micrometer length scale, is necessary for the further understanding of recrystallization boundary migration mechanisms.

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Section: Discussionmentioning

confidence: 99%

In-Situ Investigation of Local Boundary Migration During Recrystallization

Zhang

Godfrey

Jensen

2014

Metall Mater Trans A

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“…Optical microscopy is an analysis technique that can be used to study the microstructure evolution of metals during deformation [1,2]. The scanning electron microscopy (SEM) is a good way, which is used to observe the micro-strain within the materials [2,3]. The investigation of the different solid-state transformations that occur during the main processing steps (recovery, recrystallization, growth), and their kinetics can be carried out by differential scanning calorimetry (DSC) technique [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Microstructural Study and Recrystallization Kinetics of Deformed Commercial Copper Wires

Fellah¹,

Diha²,

Boumerzoug³

2018

Acta Metall. Slovaca

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This work aims to investigate the microstructure after cold-wiredrawing process of commercial copper and its recrystallization kinetics under isochronal annealing. In this paper, the samples studied are commercial copper wires reduced at six different reductions by a wiredrawing at room temperature. Optical microscopy, Scanning Electron Microscopy (SEM), and DSC were used as characterization techniques. The samples were annealed under Argon atmosphere with four different heating rates by using DSC. The Kissinger, Ozawa, Boswell, and Starink methods were used to determine the recrystallization kinetics. The results showed that the cold-wiredrawing had caused the elongation of grains along the main axis of the wires also showed the existence of slip bands. It has been found, on the one side, that the recrystallization temperature increased and shifted to higher temperatures as the heating rate increased, which means that this reaction is thermally actived; On the other sidethe recrystallization temperature clearly shifted to lower temperatures as the deformation increased, which indicated that recrystallization is profoundly enhanced by high deforming.We noted a decrease in the activation energy values when the reduction increases, the activation energy for the most reduced materials were lower than that in the less reduced wires.

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“…But evolutions of other microstructural parameters, such as average grain size, number of recrystallizing grains per unit volume, or average growth rate of recrystallizing grains, are also necessary to understand the kinetics. Most investigations of recrystallization kinetics are based on statistical analysis of a series of partially recrystallized samples characterized by optical or electron microscopy [12][13][14][15].…”

Section: Introductionmentioning

confidence: 99%

Supercube grains leading to a strong cube texture and a broad grain size distribution after recrystallization

Lin

Zhang

Pantleon

et al. 2015

Philosophical Magazine

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2015). Supercube grains leading to a strong cube texture and a broad grain size distribution after recrystallization. Philosophical Magazine, 95(22), 2427-2449. DOI: 10.1080/14786435.2015 AbstractThis work revisits the classical subject of recrystallization of cold-rolled copper. Two characterization techniques are combined: 3-dimensional X-ray diffraction using synchrotron Xrays, which is used to measure the growth kinetics of individual grains in situ, and electron backscatter diffraction, which is used for statistical analysis of the microstructural evolution. As the most striking result, the strong cube texture after recrystallization is found to be related to a few super large cube grains, which were named supercube grains. These few supercube grains become large due to higher growth rates. However, most other cube grains do not grow preferentially. Because of the few supercube grains, the grain size distribution after recrystallization is broad. Reasons for the higher growth rates of supercube grains are discussed, and are related to the local deformed microstructure.

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The Kinetics of and the Microstructure Induced by the Recrystallization of Copper

Cited by 23 publications

References 40 publications

In-Situ Investigation of Local Boundary Migration During Recrystallization

In-Situ Investigation of Local Boundary Migration During Recrystallization

Microstructural Study and Recrystallization Kinetics of Deformed Commercial Copper Wires

Supercube grains leading to a strong cube texture and a broad grain size distribution after recrystallization

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