The kinetics of a negative-tone acrylic photoresist for 193-nm lithography

Fu, Shih-Chi; Hsieh, K. H.

doi:10.1002/(sici)1099-0518(20000315)38:6<954::aid-pola4>3.0.co;2-x

Cited by 3 publications

(1 citation statement)

References 23 publications

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“…Photoresist is a pivotal material in the PCB including photoreceptor resin, photoinitiator, solvents, and additives, which can transfer the necessary fine circuit from film to the substrate after screen printing, exposure, development, etching, stripping (DES), and other photolithography processes. However, most photoresists are organic solvent-based. − These photoresists emit high levels of volatile organic compounds (VOCs) and incur environmental costs. Moreover, it poses a threat to operators in terms of health and safety that VOCs have been linked to symptoms such as drowsiness, headaches, and vertigo. − Prolonged exposure to high levels of VOCs may lead to respiratory diseases, cancer, and fatalities. , To address these concerns, waterborne photoresists have emerged as a research and development hotspot in recent years.…”

Section: Introductionmentioning

confidence: 99%

Assisted Preparation of Waterborne Anti-etching Coating for Printed Circuit Board Photoresist Using Dibenzoyl Peroxide/Copper(II)-Phthalocyanine at Room Temperature

Xu,

Li,

Wang

et al. 2023

ACS Appl. Polym. Mater.

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The waterborne printed circuit board (PCB) photoresist is a photopolymer material that offers several environmental advantages over traditional solvent-borne PCB photoresists, including low pollution, low volatility, and easy cleaning, which can effectively reduce occupational health risks. This paper presents a simple stirring-resting step-reaction at room temperature and atmospheric environment to achieve the cross-linking copolymerization of waterborne acrylic resin with trimethylolpropane triacrylate (TMPTA) through the self-decomposition reaction of dibenzoyl peroxide (BPO) with copper(II)-phthalocyanine (CuPc). Subsequently, a modified resin with both thermosetting and photosetting properties was formulated to produce a waterborne eco-friendly PCB photoresist with low volatile organic compounds (VOCs). The photoresist exhibits good water solubility and can be diluted to a maximum of 12% water content while ensuring a resolution of 35 μm. Additionally, the printing performance and rheological characteristics of photoresists with different TMPTA ratios and water contents were analyzed. It was found that the photoresist exhibited the best-related performances when the ratio of acrylic resin to TMPTA was 3:7 and the water content was 9%. This formulation requires readily available raw materials, low production equipment requirements, and simple operation and is suitable for mass production.

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Section: Introductionmentioning

confidence: 99%

Assisted Preparation of Waterborne Anti-etching Coating for Printed Circuit Board Photoresist Using Dibenzoyl Peroxide/Copper(II)-Phthalocyanine at Room Temperature

Xu,

Li,

Wang

et al. 2023

ACS Appl. Polym. Mater.

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Syntheses and characterizations of thermally degradable epoxy resins. III

Wang

Jacob

et al. 2002

J. Polym. Sci. A Polym. Chem.

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In flip-chip technology, the development of reworkable underfill materials has been one of the keys to the recovery of highly integrated and expensive board assembly designs through the replacement of defective chips. This article reports the syntheses, formulations, and characterizations of two new diepoxides, one containing secondary ester linkages and the other containing tertiary ester linkages, that are thermally degradable below 300°C. The secondary and tertiary ester diepoxides were synthesized in three and two steps, respectively. Both compounds were characterized with NMR and Fourier transform infrared spectroscopy and formulated into underfill materials with an anhydride as the hardener and an imidazole as the catalyst. A dual-epoxy system was also formulated containing the tertiary ester diepoxide and a conventional aliphatic diepoxide, 3,4-epoxy cyclohexyl methyl-3,4-epoxycyclohexyl carboxylate (ERL-4221E), with the same hardener and catalyst. The curing kinetics of the formulas were studied with differential scanning calorimetry (DSC). Thermal properties of cured samples were characterized with DSC, thermogravimetric analysis, and thermomechanical analysis. The dual-epoxy system showed a viscosity of 18.7 and 0.87 P at 25 and 100°C, respectively. The cured secondary, tertiary, and dual-epoxy formulas showed decomposition temperatures around 265, 190, and 220°C, glass-transition temperatures around 120 -140, 110 -157, and 140 -157°C, and coefficients of thermal expansion of 70, 72, and 64 ppm/°C below their glass-transition temperatures, respectively. The shear strength of the cured dual-epoxy system decreased quickly with aging at 230°C. The reworkability test showed that the removal of a chip underfilled with this material from the board was quite easy, and the residue on the board could be thoroughly removed with a mechanical brush without obvious damage to the solder mask. In summary, the synthesized tertiary epoxide can be used as a reworkable underfill for flip-chip applications.

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Pattern Generation

Gupta

2009

Copper Interconnect Technology

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The kinetics of a negative-tone acrylic photoresist for 193-nm lithography

Cited by 3 publications

References 23 publications

Assisted Preparation of Waterborne Anti-etching Coating for Printed Circuit Board Photoresist Using Dibenzoyl Peroxide/Copper(II)-Phthalocyanine at Room Temperature

Assisted Preparation of Waterborne Anti-etching Coating for Printed Circuit Board Photoresist Using Dibenzoyl Peroxide/Copper(II)-Phthalocyanine at Room Temperature

Syntheses and characterizations of thermally degradable epoxy resins. III

Pattern Generation

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