Abstract:In order to develop the SOI micro-accelerometer front release process, this paper discusses in details the key technologies of the process. There are three problems need to be resolved: the corrosion of the electrode, the corrosion rate of the buried silicon dioxide layer as well as the anti-adhesion of the micro-structure. The corrosion characteristic of the electrode is studied, and a metal electrode of high ability of anti-HF acid corrosion is designed, after release of the micro-structure, the electrode do… Show more
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