Abstract:Sintered bonding using Ag particles is one of the bonding materials that enables high-temperature operation of power modules. This bonding has begun to be applied as a die bonding material under SiC chip for getting both low heat resistance and high heat dissipation. This research report focuses on the effect of voids in the sintered Ag layer on bonding reliability. The void geometry observed with SEM(Scanning Electron Microscope) and EBSD(Electron Back Scatter Diffraction). The mechanical properties of each v… Show more
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