The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Huang, Wei; Lin, Kwang‐Lung; Lin, Yu Wei; Cheng, Yun Kai

doi:10.1007/s11664-016-5044-x

Cited by 9 publications

(3 citation statements)

References 10 publications

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“…Ternary IMC phases, (Ag, Pd) 2 Al, (Ag, Pd) 3 Al 2 and (Au,Ag) 4 Al, were probed at the Ag-Pd/Al and Ag-Au-Pd/Al interface [10,28]. However, the crystal structures and mechanical properties of these ternary phases are still unclear.…”

Section: Resultsmentioning

confidence: 99%

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

Lee

2017

J Mater Sci: Mater Electron

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In electronic packaging in recent years, silver (Ag) alloy wires have been widely adopted in wire-bond processes. The bond pads on the device chips are mostly aluminum (Al). Thus, the bonding interface is mainly Ag-Al. In recent Ag alloy wirebond publications, it is unclear what intermetallic phases form at the interface. In this research, experiments were designed to understand the Ag-Al intermetallic compound (IMC) formation in the Ag-Al system and evaluate its mechanical properties. First, the Ag-Al alloys with compositions from 19 to 43 at.% Al were evaluated to identify the phase equilibrium and crystal structure of the Ag-Al intermetallic phases. Microstructures and phase compositions of the designed Ag-Al alloys are presented. To further study the intermetallic compound formation at the Ag/Al interface, the interfacial reaction of the Ag/Al joints at 200 °C was investigated. The µ-Ag 3 Al and δ-Ag 2 Al IMC were identified to form at the Ag/Al interface and stabilize after long-time annealing at 200 °C. At last, deformation and fracture behaviors of the bulk µ-Ag 3 Al and δ-Ag 2 Al were analyzed by the micro-indentation. The measured results reveal that µ-Ag 3 Al exhibits significantly higher hardness and lower fracture toughness as compared to δ-Ag 2 Al. Indentation crack propagation in µ-Ag 3 Al demonstrates the fracture characteristics of brittle materials. In the case of δ-Ag 2 Al, the presence of slip bands exhibits the ductility of δ-Ag 2 Al to endure plastic deformation prior to fracture. The effect of the mechanical properties of the µ-Ag 3 Al and δ-Ag 2 Al IMC on the Ag-Al joint reliability is discussed. New information obtained in this research is important for future study of the joint reliability and failure mechanism of Ag-Al wire bonds.

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Section: Resultsmentioning

confidence: 99%

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

Lee

2017

J Mater Sci: Mater Electron

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“…Silver alloy wire with a high silver content has poor reliability. Huang et al [91] mentioned that 3.5% Pd inhibited Ag-Al IMC, while Pd higher than 3.5% promoted the growth of IMC. Therefore, the content of precious-metal alloy components in the silver-based bonding wire is not the higher the better, and it needs to be limited to a certain range according to different circumstances.…”

Section: Reliability Of Silver Wire Bondingmentioning

confidence: 99%

A Review of Silver Wire Bonding Techniques

An,

Zhou,

Cao

et al. 2023

Micromachines

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The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

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“…Au (gold) and Pd (palladium) elements have similar performance to Ag and can be infinitely soluble with each other. The addition of Au and Pd elements can improve the strength and high temperature stability of silver wire [ 24 ], and increase the parameter window range and interface bonding strength during bonding process [ 25 ], and inhibit the growth of intermetallics at interface (especially under high temperature and humidity conditions), which is conducive to further increasing interface reliability [ 26 ] and enhancing device life. The research and development of silver-based alloy wire with Au and Pd solves many problems in the application of single-element wire such as gold wire, copper wire and silver wire, and have broad application prospects in chip packaging such as high-density, large-scale integrated circuits and high-power LED.…”

Section: Introductionmentioning

confidence: 99%

Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire

Cao

Zhang

et al. 2021

Micromachines

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The performance of Ag-8.5Au-3.5Pd alloy wire after cold deformation and annealing were analyzed by SEM (scanning electron microscope), strength tester and resistivity tester. The processing process and performance change characteristics of Ag-8.5Au-3.5Pd alloy wire were studied. The results show that alloy wire grains gradually form a fibrous structure along with the increase in deformation. The strength of the wire increases with the increase in deformation rate, but the increase trend becomes flat once the deformation rate is higher than 92.78%; the resistivity of Ag-8.5Au-3.5Pd alloy wire decreases with the increase in annealing temperature, reaching minimum (2.395 × 10−8 Ω·m) when the annealing temperature is 500 °C; the strength of Ag-8.5Au-3.5Pd alloy wire decreases with the increase in annealing temperature. When the annealing temperature is 500 °C, the strength and elongation of the φ0.2070 mm Ag-8.5Au-3.5Pd alloy wire are 287 MPa and 25.7%, respectively; the fracture force and elongation of φ0.020 mm Ag-8.5Au-3.5Pd alloy wire are 0.0876 N and 14.8%, respectively. When the annealing temperature is 550 °C, the metal grains begin to grow and the mechanical performance decrease; the φ0.020 mm Ag-8.5Au-3.5Pd alloy wire have good surface quality when the tension range is 2.5–3.0 g.

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The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Cited by 9 publications

References 10 publications

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

A Review of Silver Wire Bonding Techniques

Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire

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