The interaction mechanism of screw dislocations with coherent twin boundaries in different face-centred cubic metals

Jin, Zhaohui; Gumbsch, Peter; Ma, Evan; Albe, Karsten; Lu, K.; Hahn, Horst; Gleiter, H.

doi:10.1016/j.scriptamat.2005.11.072

Cited by 390 publications

(216 citation statements)

References 26 publications

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“…For nt-Cu, it was shown in Ref. [11] that the obtained inter-twin flow stress for various reactions of screw and non-screw dislocations that were observed in MD simulations [4,5] is consistent with experimental measurement of flow stress [2]. But, no study of inter-twin flow stress has been done for other nanotwinned metals.…”

Section: Introductionmentioning

confidence: 68%

“…Such nanotwins have been shown to be effective for enhancing strength and preserving ductility compared to nanograins without twinning, because coherent twin boundary (TB) acts as both barrier to dislocation motion and source for dislocation generation. In molecular dynamics (MD) simulations, various reactions of screw and non-screw dislocations in the forms of absorption to TB and/or transmission to adjacent twin lamella were discovered [4][5][6]. The role of these dislocation reactions at TB in strengthening was investigated in mechanistic model [7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

“…metals such as Al and Ni [12,13], which have much higher stacking fault energies than Cu. Crystallographic analysis and MD simulation showed various reactions at TB for impinging screw and non-screw dislocations [4,5,14]. Therefore, the study of slip transfer in nanotwinned Al (nt-Al) and nanotwinned Ni (nt-Ni) is important to understand their deformation behaviour for enhancing strength and preserving ductility.…”

Section: Introductionmentioning

confidence: 99%

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Strengthening at nanoscaled coherent twin boundary in f.c.c. metals

Dao

Zhu

2014

Philosophical Magazine

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This paper analyses slip transfer at the boundary of nanoscaled growth twins in face-centred cubic (f.c.c.) metals for strengthening mechanism. The required stress for slip transfer, i.e. inter-twin flow stress, is obtained in a simple expression in terms of stacking fault energy and/or twin boundary (TB) energy, constriction energy and activation volume. For nanotwinned Al, Cu and Ni, inter-twin flow stress versus twin thickness remarkably shows Hall-Petch relationship. The Hall-Petch slope is rationalized for various reactions of screw and non-screw dislocations at the TB. Additionally, strengthening at the boundary of nanoscaled deformation twins in f.c.c. metals is analysed by evaluating required twinning stress. At small nanograin size, the prediction of deformation twin growth stress shows inverse grain-size effect on twinning, in agreement with recent experimental finding.

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Section: Introductionmentioning

confidence: 68%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Strengthening at nanoscaled coherent twin boundary in f.c.c. metals

Dao

Zhu

2014

Philosophical Magazine

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“…Depending upon the nature of the incoming reactant dislocations, the dislocation-TB interaction in nt metals may result in glissile dislocations along TBs (i.e. twinning partials), sessile dislocations or locks at TBs, and/or outgoing dislocations or stacking faults in the neighboring twin planes (Christian and Mahajan, 1995;Jin et al, 2008Jin et al, , 2006Lu et al, 2005;Mahajan et al, 1970;Zhu et al, 2007). Those dislocations/faults accumulated on TBs remain mobile or/and become dislocation sources because of the TB coherency.…”

Section: Resistance Of Nanotwins Against Creep Deformationmentioning

confidence: 99%

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Yang

Wang

et al. 2016

Acta Materialia

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a b s t r a c tIn the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22°C (RT), 40°C, 50°C, 60°C, and 70°C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinning could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper.

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“…196 These methods have been extended from energies to calculating the properties of individual grain boundaries in an effort to understand grain boundary mechanics, such as dislocation nucleation, [115][116][117][118]197 grain boundary sliding, 198 spall strength, 199,200 fracture, 201 and GBdislocation interactions. 202,203 In many cases, it was found that the grain boundary properties are not simply governed by the crystallographic orientations of the adjacent grains (e.g., see Ref. 119) nor the average properties of the boundary (e.g., energy, excess volume, etc.…”

Section: Grain Boundary (Bicrystal) MD Simulationsmentioning

confidence: 99%

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Tschopp

Murdoch

Kecskes

et al. 2014

JOM

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It is a new beginning for innovative fundamental and applied science in nanocrystalline materials. Many of the processing and consolidation challenges that have haunted nanocrystalline materials are now more fully understood, opening the doors for bulk nanocrystalline materials and parts to be produced. While challenges remain, recent advances in experimental, computational, and theoretical capability have allowed for bulk specimens that have heretofore been pursued only on a limited basis. This article discusses the methodology for synthesis and consolidation of bulk nanocrystalline materials using mechanical alloying, the alloy development and synthesis process for stabilizing these materials at elevated temperatures, and the physical and mechanical properties of nanocrystalline materials with a focus throughout on nanocrystalline copper and a nanocrystalline Cu-Ta system, consolidated via equal channel angular extrusion, with properties rivaling that of nanocrystalline pure Ta. Moreover, modeling and simulation approaches as well as experimental results for grain growth, grain boundary processes, and deformation mechanisms in nanocrystalline copper are briefly reviewed and discussed. Integrating experiments and computational materials science for synthesizing bulk nanocrystalline materials can bring about the next generation of ultrahigh strength materials for defense and energy applications.

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The interaction mechanism of screw dislocations with coherent twin boundaries in different face-centred cubic metals

Cited by 390 publications

References 26 publications

Strengthening at nanoscaled coherent twin boundary in f.c.c. metals

Strengthening at nanoscaled coherent twin boundary in f.c.c. metals

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

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