We have fabricated a low-mass, high-density, hybrid circuit for the silicon microstrip sensors in high track density environment, such as the ATLAS silicon microstrip detector upgrade toward the super LHC project. A technology of copper-polyimide flexible circuit board and carboncarbon reinforced material was applied to the hybrid. The weight of bare flex circuit for the hybrid is 1.91g. By using button plating techniques for via-holes and through-holes, a considerable weight reduction of 1.18g has been achieved compared with an usual plating. In this paper, a detail description for hybrid circuit is presented with a module design. Electrical test results of the front-end chips on the hybrid are also discussed.