2001
DOI: 10.1016/s0257-8972(01)01334-2
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The influence of vapor–gaseous envelope behavior on plasma electrolytic coating removal

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Cited by 41 publications
(22 citation statements)
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“…These processes are used for surface finishing, including case hardening, nitriding and carbonitriding, [3,7,[17][18][19][20], surface oxidation [21][22][23][24][25], cleaning [26,27] and polishing [28][29][30] as well as stripping of defective coatings [6,31].…”
Section: Brief Characteristics Of Electrolytic Plasma Processesmentioning
confidence: 99%
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“…These processes are used for surface finishing, including case hardening, nitriding and carbonitriding, [3,7,[17][18][19][20], surface oxidation [21][22][23][24][25], cleaning [26,27] and polishing [28][29][30] as well as stripping of defective coatings [6,31].…”
Section: Brief Characteristics Of Electrolytic Plasma Processesmentioning
confidence: 99%
“…With the forward biased junction, the EPP features a vapour gaseous envelope (VGE) surrounding the working electrode. Most of the voltage drop occurs 6 across the VGE which is a non-stationary object with a high field, promoting a plasma discharge in the gas media. With the reverse biased junction, the EPP on the anode features formation of a stationary oxide film which attains the majority of the voltage drop.…”
Section: Brief Characteristics Of Electrolytic Plasma Processesmentioning
confidence: 99%
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