2014 15th International Conference on Electronic Packaging Technology 2014
DOI: 10.1109/icept.2014.6922781
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The influence of the solder joint void on the CCGA package reliability

Abstract: Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. The void of the solder joint has a significant influence on the CCGA package reliability. This paper introduced two reflow processes of CCGA717 package (N 2 and vacuum atmosphere), it specifically discussed the solder joint strength, board-level … Show more

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