The influence of the solder joint void on the CCGA package reliability

Abstract

Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. The void of the solder joint has a significant influence on the CCGA package reliability. This paper introduced two reflow processes of CCGA717 package (N 2 and vacuum atmosphere), it specifically discussed the solder joint strength, board-level reliability of the CCGA package. By design of the daisy-chain substrate, the board-level reliability of the CCGA packages were investigated. This study showed that with the low void rate( 5%), the CCGA solder joint will get a high joint strength and high boardlevel reliability.