The influence of the laser spot size and the pulse number on laser-induced backside wet etching

Böhme, R.; Zimmer, Klaus

doi:10.1016/j.apsusc.2005.01.058

Cited by 44 publications

(29 citation statements)

References 24 publications

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“…4 shows the tendency of the etch rate reduction at reduced spot size. A similar behavior was observed at backside wet etching with hydrocarbons, too [6]. However, the reasons for the size dependent rate reduction might be different due to the different material properties and various processes involved in etching.…”

Section: Backside Etching With Galliumsupporting

confidence: 67%

“…Laser-induced backside wet etching (LIBWE) is an indirect etching technique using pulsed laser radiation that was demonstrated first for fused silica applying a pyrenedoped acetone solution [1]. The etch rate in dependence on the processing parameters and the properties of the etched surface are studied extensively [1][2][3][4][5][6][7]. The complex processes of laser-induced backside wet etching that are currently not well understood in detail comprise a sequence of physical and chemical processes including laser-induced heating of the liquid and subsequently of the solid, the softening/melting of the material, and consequently the removing of the weakened material by mechanical forces due to shock waves and high pressures.…”

Section: Introductionmentioning

confidence: 99%

“…However, the backside etching process is regularly accompanied by incubation effects [6,11], similar to laser ablation in air [12], with the result of instabilities of the etching at low fluences and pulse numbers. Further the increase of the etch rate and the reduction of the threshold fluence for prolonged etching with increasing pulse number was found.…”

Section: Introductionmentioning

confidence: 99%

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Enhancing the Etch Rate at Backside Etching of Fused Silica

Zimmer¹

2006

JLMN

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Employing optical phase-contrast microscopy we study the morphology of ultrashort pulsed laser-induced modifications in bulk fused silica and in other optical transparent materials for different conditions of irradiation. The influence of the input pulse energy, focusing depth, and number of pulses per site is investigated in order to establish optimal irradiation conditions for direct writing of waveguiding elements. The results obtained suggest that an increase of the refractive index is systematically accompanied by a region of lower index of refraction along the optical axis, presumably due to micro-explosion in the high energy-exposed regions, and the locations of this region is material dependent. Nevertheless, the creation of an hypothetical void in the interaction zone does not allow a complete explanation of the modifications observed and other mechanisms have to be invoked to explain the presence of regions with higher index of refraction. Different interaction regimes with respect to the input energy and to the number of shots per site can be established from these observations, emphasizing the role of nonlinear pulse propagation and plasma generation. To complement the experimental observations we simulate the propagation of an ultrashort laser pulse in bulk silica using the non-linear Schrödinger equation and determine the distribution of energy along the propagation axis. The results are in good agreement with the experimental observations and provides insights into the mechanisms controlling the interaction between ultrashort laser pulses and transparent materials.

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Section: Backside Etching With Galliumsupporting

confidence: 67%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Enhancing the Etch Rate at Backside Etching of Fused Silica

Zimmer¹

2006

JLMN

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“…The specific pulse number, which is required for starting the etching process, decreases with the increasing used laser fluence. This incubation effect is characteristic for LIBWE using organic absorber liquids [16]. After overcoming the required number of laser pulses to start the etching process, the etching rate increases with increasing number of laser pulses.…”

Section: Resultsmentioning

confidence: 99%

Laser-induced back-side etching with liquid and the solid hydrocarbon absorber films of different thicknesses

et al. 2017

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“…The dependence of the etch rate on the processing parameters and the properties of the etched surface have been studied extensively [1][2][3][4][5][6][7]. The etching mechanism comprises a sequence of processes including laser-induced heating of the liquid and subsequently of the solid, softening/melting of the solid material, and detachment of the weakened material by mechanical forces such as shock waves and high pressures.…”

Section: Introductionmentioning

confidence: 99%