The influence of small impurity additions and direct electric current on the kinetics of contact melting in metals

Influence of Pressure on the Melting Temperature in the Contact of Expanded Nanofilms and Nanoparticles Used in Electronics

“…First, the dimensional dependence of temperature of contact melting has been obtained regards to the contact of microparticles. It has been assumed, that the loosened nanoparticle A have been covered by environment of metal B, between which diffusion occurs in a thin boundary layer (diffusion mechanism of CM) [14]. Using a condition of balance of chemical potentials between a crystal grain of radius r, representing firm solution A in B, surrounded by its own melt in view of surface pressure [15], the equality of chemical potentials looks like:…”

“…Where µ -chemical potential; σ -interphase energy; Ω -atomic volume, λ -heat of CM. Indexes characterize phases (S -firm, L -liquid), δТ -analogue of Tolmen constant for loosened nanoparticles [14].…”

“…In works [5,6,7] an opportunity of the mechanism of abnormal fast speed of phase transition at initial stage of CM is explained at a qualitative level. Not denying an opportunity of display of 1-st and 2-nd approaches described above, authors of works [5,6,7] suggest to take into account an influence of a relief of a surface of crystals, which are in contact: there is a contact of nanoobjects (ledges) that causes dimensional dependence of solubility and diffusion [8], increasing them. That affects their melting point [9,10].…”

Diffusional Interaction in Tin Film – Nickel Base System

“…M.Z. Laipanov 1 In this work a Sn film was deposited on the nickel base of NP-2 sort in vacuum and bimetal nickel-tin compositions have been received. Eutectic formations, arising at the surface of tin film owing to a diffusional cooperation with the nickel base have been found by the scanning electron microscopy method.…”

“…Диффузионное взаимодействие может использоваться во многих практически важных технологических процессах [1]: жидкофазном спекании микро и нанопорошков, получении биметаллических систем [2], контактно-реактивной пайке, металлизации керамик и полупроводников и т.д. [3].…”