The Influence of Size and Composition on the Creep of SnAgCu Solder Joints

Wiese, S.; Roellig, M.; Mueller, Maik; Rzepka, Sven; Nocke, K.; Luhmann, C.; Kraemer, Frank Alexander; Meier, Karsten; Wolter, Klaus‐Jürgen

doi:10.1109/estc.2006.280120

Cited by 18 publications

(4 citation statements)

References 15 publications

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“…Figure 9 investigates how the upper hold temperature influences the dissipation. Note that these simulations were made for SnAg2.7Cu0.4Ni0.05 [5,9] and not for the generic type of SAC [4] solder as before. As expected an increase of the hold time leads to a (considerable) increase in dissipation.…”

Section: Materials Parametersmentioning

confidence: 99%

Simple Methods for the Durability Assessment of Microelectronic Solders

Müller

Hauck²

2008

Mechanics of Advanced Materials and Structures

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This paper presents a simple method, based on a 1-D model, that allows us to assess the impact of an essentially arbitrary thermal cycle test on the creep strain and energy dissipation in solder materials. Such tests are typically performed in order to assess the reliability and the lifetime of solders used for electrical and mechanical connection of microelectronic components. The method is applied to study the dissipated energy in terms of the stress-strain hysteresis in various solders, both lead-free as well as lead-containing. A first comparison between a full finite element study of the stress-strain hysteresis loop and the simplified approach is performed. It is shown that both lead to the same trends regarding creep strains and energy dissipation, however, the absolute values differ. For this reason a re-scaling procedure is proposed which allows to use the simplified approach for quantitative predictions.

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Section: Materials Parametersmentioning

confidence: 99%

Simple Methods for the Durability Assessment of Microelectronic Solders

Müller

Hauck²

2008

Mechanics of Advanced Materials and Structures

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“…The coefficients for this composition and solder joint condition are listed below_ The secondary creep measurements were conducted by loading one dog bone shaped specimen (Fig_ 3) at different but constant forces_ The first loading force always has been the highest Every further load step was conducted by lower forces_ Previous investigations have shown the primary creep dominantly occurs in the very first loading regime [14]. Accordingly, after reaching the secondary creep conditions the applied force load was stepwise reduced (see Fig_ 17)_ Certain deformation rates were measured in dependency of the applied force_ The secondary strain rate has been observed on SnAg3_5 in a range between 10-2 to 10-9 S-I _ The total specimen strain over all force steps is approx_ 2 % and far from being damaged.…”

Section: R-t[k]mentioning

confidence: 99%

Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3.5 solder

Roellig

Metasch

Meier

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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The application of solder joints for electrical and mechanical interconnections between two functional layers in electronic packages will be present in future devices, even in 3D-electronic devices. Very different approaches are investigated such as copper pillar, full inter-metallic joints or Au-Sn nanosponge. But the interconnection realization by -solder bumps as well as Flip-Chip solder joints will be one high potential connection method. The fundamentals about the solder alloy properties are necessary for material selection at product planning phase and further for the reliability estimations. Modem simulation tools are used for weak point estimations as well as for lifetime estimations (e.g. FEM). Any simulation software demands martial properties. The paper presents an excerpt of characterization techniques and results for the following physical data of SnAg3.5 solder: Elastic modulus Poisson ratio Creep Lin. thermal expansion (CTE) Thermal conductivity Ele ctrical conductivity Fatigue

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“…the grain size and grain orientation, and the reliability properties under mechanical loading has to be taken into consideration (Fig.1). During the last years many studies were carried out in order to investigate the material behavior and the microstructure of solder and wire bond materials [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

Electron backscatter diffraction microstructure investigations of electronic materials down to the nanoscale

Krause

März

Dresbach

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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In this paper, the application of electron backscatter diffraction (EBSD) methods to materials used for common microelectronic interconnection technologies is demonstrated with particular emphasis to lead-free soldered interfaces and thermosonic wire bond interconnects. Here, the paper focuses on the quantitative analysis of grain orientation, grain size and grain distribution of SAC as well as gold, aluminum and copper bonding wire materials. In addition special attention is paid to high resolution analysis of the intermetallics formed in the interfaces of microelectronic packaging interconnects. The application and the potential of EBSD to detect the Cu/Sn, Ni/Sn and Au/Al intermetallics being practically relevant for soldering and wire bonding is demonstrated

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The Influence of Size and Composition on the Creep of SnAgCu Solder Joints

Cited by 18 publications

References 15 publications

Simple Methods for the Durability Assessment of Microelectronic Solders

Simple Methods for the Durability Assessment of Microelectronic Solders

Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3.5 solder

Electron backscatter diffraction microstructure investigations of electronic materials down to the nanoscale

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