2016
DOI: 10.1016/j.ceramint.2016.08.171
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The influence of pulse plating parameters on microstructure and properties of Ni-W-Si3N4 nanocomposite coatings

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Cited by 50 publications
(5 citation statements)
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“…Therefore, to meet the demand for high-performance coatings in harsh environments, researchers have tried to incorporate nanoparticles into the Ni-W matrix to improve its corrosion resistance. In recent years, many studies have reported using Al 2 O 3 [15,16], SiC [17][18][19], TiN [20], ZrO 2 [21], BN [22], Si 3 N 4 [23] and other particles as the reinforcing phase to prepare metal matrix…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, to meet the demand for high-performance coatings in harsh environments, researchers have tried to incorporate nanoparticles into the Ni-W matrix to improve its corrosion resistance. In recent years, many studies have reported using Al 2 O 3 [15,16], SiC [17][18][19], TiN [20], ZrO 2 [21], BN [22], Si 3 N 4 [23] and other particles as the reinforcing phase to prepare metal matrix…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, researchers found that the hardness, corrosion resistance, wear resistance, physical and chemical properties of Ni-W metallic matrix could be improved by the addition of hard ceramic particles (e.g. TiN [5], [6], BN [7,8], WC [9], SiC [10][11][12], Si 3 N 4 [13][14][15], diamond [16], ZrO 2 [17], etc) into the alloy matrix. Several techniques have been used to fabricate Ni-W nanocomposite coating [18], in which the electrodeposition process is a convenient, low-cost, efficient and most widely applied method in various industries [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…It has been reported that the employment of pulse current can significantly reduce the internal stress of electric casting compared with the conventional DC at the same average current density. Recently, Li et al [ 16 ] have studied the effect of pulse electroplating on the surface roughness of electrodeposited nickel films. Marro et al [ 17 ] also found the influence of pulse plating process parameters on the morphology and stress state of Cu film.…”
Section: Introductionmentioning
confidence: 99%