The influence of power spinning and annealing temperature on microstructures and properties of Cu-Sn alloy

Jiang, Hui; Feng, Zhijun; Wenxin, Fan; Xia, Yuan

doi:10.1016/j.matchar.2018.08.015

Cited by 20 publications

(17 citation statements)

References 20 publications

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“…First, a high thinning rate induces large deformation during power spinning, which requires that the processed Cu–Sn alloy has good plasticity and low BH (Xu et al, 2016; Hui et al, 2018). The microstructure of the Cu–Sn alloy before spinning is shown in Figure 2a, which features equiaxed recrystallization grains and large numbers of twins.…”

Section: Resultsmentioning

confidence: 99%

“…The highest peak appeared at 60°, representing the annealing twin <111>Σ3. Many studies have observed a subpeak at 40° (Hui et al, 2018). This phenomenon occurs, because multiple-twin boundaries (Σ9) are produced when Σ3 grain boundaries encounter different {111} faces and the Σ9 grain boundary is at 40°.…”

Section: Resultsmentioning

confidence: 99%

“…The EBSD sampling position of the spinning sample is illustrated in Figure 1 (Hui et al, 2018). Electropolishing was required, because the signal measured in EBSD comes from a thin 50-nm-thick layer on the sample surface.…”

Section: Experimental Materials and Methodsmentioning

confidence: 99%

“…Power spinning greatly improves the Cu–Sn strength and hardness. This effectively enhances fatigue and corrosion resistance (Hui et al, 2018). In this study, a Cu–Sn alloy sliding bearing was the research object.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Heat Treatment Temperature on the Spinning Structure and Properties of a Cu–Sn Alloy

Liu

Zheng

2019

Microsc Microanal

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A thin-walled copper (Cu)–tin (Sn) alloy cylinder was treated after spinning at 200–400°C for 0.5 h. The characteristics of the alloy microstructure under different temperatures were analyzed through electron back-scattered diffraction. The results were as follows. The grain size at 200–300°C decreases as the heat treatment temperature rises, but the grain size at 400°C increases. At 200–300°C, the microstructure primarily consists of deformed grains. It is found that the main reason for the formation of high-angle grain boundaries (HAGBs) is static recrystallization. For the grain boundary orientation differential, the low-angle sub-grain boundary gradually grows into the HAGB, and multiple annealing twin Σ9 boundaries appear. Grain orientation is generally random at any temperature range. The mechanical property test indicated that, at the upper critical recrystallization temperature of 300°C, the elongation of the Cu–Sn alloy gradually increases, and its yield strength and ultimate tensile strength rapidly decrease.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Experimental Materials and Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Effect of Heat Treatment Temperature on the Spinning Structure and Properties of a Cu–Sn Alloy

Liu

Zheng

2019

Microsc Microanal

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“…For instance, Hu and Wang [17] and Chang et al [18] studied the influence of solution treatment on spun parts; they found that the residual stress could be eliminated and the grain size refined. Hui et al [19] revealed that annealing treatment promoted the formation of equiaxed grains in a Cu-Sn alloy spun part. Tsivoulas et al [20] found that the residual stress decreased in Cr-Mo-V steel tubes during heat treatment.…”

Section: Introductionmentioning

confidence: 99%

Residual-stress relaxation mechanism and model description of 5052H32 Al alloy spun ellipsoidal heads during annealing treatment

et al. 2021

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Marginal-restraint mandrel-free spinning is an advanced technology for manufacturing ellipsoidal heads with large diameter-thickness ratios. Nevertheless, the spinning-induced residual stress, which greatly influences the in-service performance of spun heads, should be removed. In this study, the effects of annealing on the residual-stress relaxation behavior of 5052H32 aluminum alloy spun heads were investigated. It is found that the residual stress first rapidly decreases and then remains steady with the increase in annealing time at the tested annealing temperatures. The relaxation of the residual stress becomes increasingly obvious with the increase in annealing temperature. When the annealing temperature is less than 220 °C, there are no obvious changes in grain size. Moreover, the spinning-induced dislocations are consumed by the static recovery behavior, which decreases the residual stress during annealing. When the annealing temperature is approximately 300 °C, the broken grains transform into equiaxed grains. In addition, static recrystallization and recovery behaviors occur simultaneously to promote the relaxation of the residual stress. Considering the different stress relaxation mechanisms, a model based on the Zener-Wert-Avrami equation was established to predict the residual-stress relaxation behavior. Finally, the optimized annealing temperature and time were approximately 300 °C and 30 min, respectively.

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Effect of Thermomechanical Treatment on Microstructural and Localized Micromechanical Properties of Sn–0.7Cu Solder Alloy

Yusoff

Bakar

Jalar

2023

Springer Proceedings in Physics

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The influence of power spinning and annealing temperature on microstructures and properties of Cu-Sn alloy

Cited by 20 publications

References 20 publications

Effect of Heat Treatment Temperature on the Spinning Structure and Properties of a Cu–Sn Alloy

Effect of Heat Treatment Temperature on the Spinning Structure and Properties of a Cu–Sn Alloy

Residual-stress relaxation mechanism and model description of 5052H32 Al alloy spun ellipsoidal heads during annealing treatment

Effect of Thermomechanical Treatment on Microstructural and Localized Micromechanical Properties of Sn–0.7Cu Solder Alloy

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