The influence of nanoscale morphology on the resistivity of cluster-assembled nanostructured metallic thin films

Barborini, E.; Corbelli, Gabriele; Bertolini, G.; Repetto, Pietro; Leccardi, M.; Vinati, S.; Milani, P.

doi:10.1088/1367-2630/12/7/073001

Cited by 41 publications

(29 citation statements)

References 36 publications

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“…The difference in the resistivity values between atomassembled and cluster-assembled lms is due to the presence of an extremely large number of defects and grain boundaries typical of the low-energy cluster beam deposition regime [38][39][40][41] resulting in highly porous lms. 42,43 The nanogranular and porous structure of the Au clusterassembled lms affects their electrical behavior, for thickness far beyond the percolation threshold, in a dramatic and unexpected way: we observe either a remarkable departure from an ohmic behavior and the onset of a resistive switching feature. The I-V curve of the cluster-assembled lm is reported in Fig.…”

Section: Resultsmentioning

confidence: 82%

Non-ohmic behavior and resistive switching of Au cluster-assembled films beyond the percolation threshold

et al. 2019

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Section: Resultsmentioning

confidence: 82%

Non-ohmic behavior and resistive switching of Au cluster-assembled films beyond the percolation threshold

et al. 2019

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“…The growth of cluster-assembled metallic films has been studied mainly in the sub-monolayer regime with particular focus on transition metal clusters [76,77], noble metals [42,[78][79][80], bismuth [81][82][83], tin [84] and antimony [85,86]. Nucleation and growth process of Bi and Sb thin films grown by atomic and cluster deposition has been characterized by transmission electron microscopy (TEM) showing the high sensitivity of the film structure to the size of incident precursors [34,81].…”

Section: Cluster-assembled Film Growthmentioning

confidence: 99%

Electrical conduction in nanogranular cluster-assembled metallic films

Mirigliano

Milani

2021

Advances in Physics: X

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A film fabricated by the assembling of nanoparticles that retain, at least partially, their individuality is expected to show substantially different structural and functional properties compared to the case where atoms or molecules are used as building blocks. Although films assembled with metallic clusters or nanoparticles have been predicted to have unusual functional properties, it has been tacitly assumed that cluster-assembled metallic films have the same conduction behavior observed for polycrystalline metallic thin films grown from atoms. Unexpectedly, in the last decade, several studies showed that nanogranular metallic films show a non-linear electric behavior, substantially different from their polycrystalline counterparts. Here we review and discuss the electrical transport properties of cluster-assembled films. Our aim is to provide a background and a common language for the systematic investigation and exploitation of nanogranular metallic thin films where the extremely high density of defects and grain boundaries causes the departure from ohmic behavior. We will focus on the non-linear electrical conduction and resistive switching relevant for neuromorphic applications.

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“…Our approach relies on the fact that the electrical properties of cluster-assembled films grown from the gas phase evolve in a significantly different way compared to atom-assembled films. 20 In particular, in the percolative regime, electrical conduction can be precisely controlled by SCBD, 21 thus allowing the tuning of the resistance while keeping constant the dimensions of the resistors and optimizing the use of raw material.…”

Section: 2mentioning

confidence: 99%

“…20,21 This indicates that the capability of SCBD of producing in one step resistors with different dimensions in a wide range of resistance values, is due to the capability of working in a well determined region of the electrical percolation curve of the cluster-assembled films. 21,23 In order to quantify the amount of clusters deposited on the substrate, we use a quantity called equivalent thickness (t eq ) defined as the thickness of a film produced by an equivalent amount of nanoparticles deposited onto a rigid flat substrate. 23 The equivalent thickness is obtained in real time, during the deposition process, by the use of a quartz crystal microbalance placed near the sample, allowing us to stop the deposition at the achievement of the required thickness and hence resistance.…”

Section: 2mentioning

confidence: 99%

High-throughput shadow mask printing of passive electrical components on paper by supersonic cluster beam deposition

Caruso

Bellacicca

Milani

2016

Applied Physics Letters

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We report the rapid prototyping of passive electrical components (resistors and capacitors) on plain paper by an additive and parallel technology consisting of supersonic cluster beam deposition (SCBD) coupled with shadow mask printing. Cluster-assembled films have a growth mechanism substantially different from that of atom-assembled ones providing the possibility of a fine tuning of their electrical conduction properties around the percolative conduction threshold. Exploiting the precise control on cluster beam intensity and shape typical of SCBD, we produced, in a one-step process, batches of resistors with resistance values spanning a range of two orders of magnitude. Parallel plate capacitors with paper as the dielectric medium were also produced with capacitance in the range of tens of picofarads. Compared to standard deposition technologies, SCBD allows for a very efficient use of raw materials and the rapid production of components with different shape and dimensions while controlling independently the electrical characteristics. Discrete electrical components produced by SCBD are very robust against deformation and bending, and they can be easily assembled to build circuits with desired characteristics. The availability of large batches of these components enables the rapid and cheap prototyping and integration of electrical components on paper as building blocks of more complex systems.

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The influence of nanoscale morphology on the resistivity of cluster-assembled nanostructured metallic thin films

Cited by 41 publications

References 36 publications

Non-ohmic behavior and resistive switching of Au cluster-assembled films beyond the percolation threshold

Non-ohmic behavior and resistive switching of Au cluster-assembled films beyond the percolation threshold

Electrical conduction in nanogranular cluster-assembled metallic films

High-throughput shadow mask printing of passive electrical components on paper by supersonic cluster beam deposition

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