The influence of morphology and composition of metal–carbide coatings deposited on the diamond surface on the properties of copper–diamond composites

Ukhina, Arina V.; Dudina, Dina V.; Esikov, Maksim A.; Samoshkin, D. A.; Stankus, S. V.; Сковородин, И. Н.; Галашов, Е. Н.; Bokhonov, Boris B.

doi:10.1016/j.surfcoat.2020.126272

Cited by 36 publications

(12 citation statements)

References 27 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The low thermal expansion coefficients of the composites further confirm a strong diamond-Cu connection. It can be seen from Figure 6F that compared with the diamond/Cu composite reported in the literature, 6,8,10,13,15,16,[18][19][20]32,33 the experimental thermal diffusivity of 311 mm 2 s −1 is the highest, and the density of 3.78 g cm −3 is the lowest, which are more in line with the requirements of high thermal diffusion and lightweight electronic packaging materials.…”

supporting

confidence: 76%

“…12 Commonly used transition layer metals include Chromium (Cr), [12][13][14] Titanium (Ti), 5 Zirconium (Zr), 8,15 Boron (B), [16][17][18] and Tungsten (W). 10,19,20 For instance, adding 1.5 wt% Ti to Cu metal was reported to improve the interface bonding between the copper matrix and diamond, in which the thermal conductivity of the Cu-diamond (55 vol%) composite prepared by hot forging can reach up to 410 W m −1 K −1 . 5 In another study, it was reported that Cu-3 wt% Cr/diamond (55 vol%) composite materials have a thermal conductivity of 433 W m −1 K −1 .…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Lightweight diamond/Cu interface tuning for outstanding heat conduction

Dou

Zhu

et al. 2023

Carbon Energy

View full text Add to dashboard Cite

With rapid developments in the field of very large‐scale integrated circuits, heat dissipation has emerged as a significant factor that restricts the high‐density integration of chips. Due to their high thermal conductivity and low thermal expansion coefficient, diamond/Cu composites have attracted considerable attention as a promising thermal management material. In this study, a surface tungsten carbide gradient layer coating of diamond particles has been realized using comprehensive magnetron sputtering technology and a heat treatment process. Diamond/Cu composites were prepared using high‐temperature and high‐pressure technology. The results show that, by adjusting the heat treatment process, tungsten carbide and di‐tungsten carbide are generated by an in situ reaction at the tungsten–diamond interface, and W–WC–W2C gradient layer‐coated diamond particles were obtained. The diamond/Cu composites were sintered by high‐temperature and high‐pressure technology, and the density of surface‐modified diamond/Cu composites was less than 4 g cm−3. The W–WC–W2C@diamond/Cu composites have a thermal diffusivity as high as 331 mm2 s−1, and their thermal expansion coefficient is as low as 1.76 × 10−6 K−1. The interface coherent structure of the gradient layer‐coated diamond/copper composite can effectively improve the interface heat transport efficiency.

show abstract

supporting

confidence: 76%

Section: Introductionmentioning

confidence: 99%

Lightweight diamond/Cu interface tuning for outstanding heat conduction

Dou

Zhu

et al. 2023

Carbon Energy

View full text Add to dashboard Cite

show abstract

“…Measuring of stresses under the antenna and under uncoated surface could reveal a stressfree temperature. Similar principles might apply to reflective coatings that are used for some applications, and other cases of material deposition on the surface of the diamond [54] as well as gluing diamond crystals to different surfaces [23,55].…”

Section: Discussionmentioning

confidence: 96%

NV microscopy of thermally controlled stresses caused by Cr$_2$O$_3$ thin films

Bērziņš¹,

Šmits²,

Petruhins³

et al. 2021

Preprint

View full text Add to dashboard Cite

Many modern applications, including quantum computing and quantum sensing, use substratefilm interfaces. Particularly, thin films of chromium or titanium and their oxides are commonly used to bind various structures, such as resonators, masks, or microwave antennas, to a diamond surface. Due to different thermal expansions of involved materials, such films and structures could produce significant stresses, which need to be measured or predicted. In this paper, we demonstrate imaging of stresses in the top layer of diamond with deposited structures of Cr2O3 at temperatures 19 • C and 37 • C by using stress-sensitive optically detected magnetic resonances (ODMR) in NV centers. We also calculated stresses in the diamond-film interface by using finite-element analysis and correlated them to measured ODMR frequency shifts. As predicted by the simulation, the measured high-contrast frequency-shift patterns are only due to thermal stresses, whose spin-stress coupling constant along the NV axis is 21±1 MHz/GPa that is in agreement with constants previously obtained from single NV centers in diamond cantilever. Our widefield imaging demonstrates the NV microscopy as a convenient platform that could optically detect and quantify spatial distributions of stresses in diamond-based photonic devices with a micrometer precision. Our results also show that thin film structures produce significant stresses in them, that should be accounted for in NV-based applications.

show abstract

“…An example is the development of metal–diamond composites with a high thermal conductivity, in which the diamond fillers are of core–shell structure. The shell on the diamond particles, a carbide coating, is formed to improve the wettability of the filler by the matrix metal [ 2 ]. Forming a metallic shell on diamond particles was shown to increase the diamond content in cold-sprayed coatings formed from mixtures of diamond crystals with an aluminum powder [ 3 ].…”

Section: Introductionmentioning

confidence: 99%

Core–Shell Particle Reinforcements—A New Trend in the Design and Development of Metal Matrix Composites

Dudina

Georgarakis

2022

Materials

Self Cite

View full text Add to dashboard Cite

Metal matrix composites (MMCs) are a constantly developing class of materials. Simultaneously achieving a high strength and a high ductility is a challenging task in the design of MMCs. This article aims to highlight a recent trend: the development of MMCs reinforced with particles of core–shell structure. The core–shell particles can be synthesized in situ upon a partial transformation of metal (alloy) particles introduced into a metal matrix. MMCs containing core–shell particles with cores of different compositions (metallic, intermetallic, glassy alloy, high-entropy alloy, metal-ceramic) are currently studied. For metal core–intermetallic shell particle-reinforced composites, the property gain by the core–shell approach is strengthening achieved without a loss in ductility. The propagation of cracks formed in the brittle intermetallic shell is hindered by both the metal matrix and the metal core, which constitutes a key advantage of the metal core–intermetallic shell particles over monolithic particles of intermetallic compounds for reinforcing purposes. The challenges of making a direct comparison between the core–shell particle-reinforced MMCs and MMCs of other microstructures and future research directions are discussed.

show abstract

The influence of morphology and composition of metal–carbide coatings deposited on the diamond surface on the properties of copper–diamond composites

Cited by 36 publications

References 27 publications

Lightweight diamond/Cu interface tuning for outstanding heat conduction

Lightweight diamond/Cu interface tuning for outstanding heat conduction

NV microscopy of thermally controlled stresses caused by Cr$_2$O$_3$ thin films

Core–Shell Particle Reinforcements—A New Trend in the Design and Development of Metal Matrix Composites

Contact Info

Product

Resources

About