The influence of interfaces and water uptake on the dielectric response of epoxy-cubic boron nitride composites

Abstract

In this study, epoxy-cubic boron nitride composites are fabricated, and their dielectric response is investigated. They exhibit the same trend as epoxy composites reinforced with other filler types. Thus, at low filler concentrations, they exhibit a lower relative permittivity than neat epoxy. As the fill grade further increases, the relative permittivity of the composites increases as well. It is suggested that two competing mechanisms, namely polymer re-organization and water uptake, mainly determine the dielectric response of epoxy composites. The former is related to the decrease while the latter to the increase of the relative permittivity. The experimental results clearly verify that water uptake strongly depends on the filler concentration and not only affects the dielectric response of epoxy composites but also it is one of the main mechanisms which dictate their dielectric behavior.

Properties of Polymer Composites Used in High-Voltage Applications

“…Taking into consideration this aspect, nanoparticles and matrix drying under vacuum conditions or nanoparticles surface functionalization, which replace surface hydroxyl groups and physically block water from getting to the surface of the particles, should be necessary steps. The presence of water can have additional effects on the behavior of nanocomposites, leading to changes in their dielectric behavior [ 158 , 170 ].…”

Investigation on enhancement of filler dispersion and prediction of mechanical behavior of hexagonal boron nitride/epoxy nanocomposites through machine learning and deep learning models

“…[11][12][13][14][15] Ceramic fillers such as aluminum nitride and boron nitride (cubic and hexagonal) particulates can form a network of reinforcing structures within the epoxy matrix, thereby enhancing its rigidity and strength. [16][17][18] The high thermal conductivity of additives can also aid in the material's heat dissipation, making the material useful for high-temperature applications. 19 In addition, AlN and hBN can impart barrier properties to epoxy nanocomposites.…”

“…Nano clays, graphene, carbon nanotube (CNT), and Nano silica are common nanofillers used for improving strength, stiffness, thermal stability, and resistance to erosion and corrosion 11–15 . Ceramic fillers such as aluminum nitride and boron nitride (cubic and hexagonal) particulates can form a network of reinforcing structures within the epoxy matrix, thereby enhancing its rigidity and strength 16–18 . The high thermal conductivity of additives can also aid in the material's heat dissipation, making the material useful for high‐temperature applications 19 .…”