1983
DOI: 10.1080/01422448308209643
|View full text |Cite
|
Sign up to set email alerts
|

The influence of hydrogen ion bombardment on the photovoltaic properties of Cu/Cu2O schottky barrier solar cells

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
3
0

Year Published

1985
1985
2017
2017

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 8 publications
(3 citation statements)
references
References 1 publication
0
3
0
Order By: Relevance
“…2 with the depth profiles of constituent elements determined from AES for Cu/Cu,O junctions obtained by H + ion bombardment [ 121 enables us to explain the possible mechanism of the native IL modification (case B). Incident H + ions, especially those belonging to the high energy tail of their spectrum, when passing through a thin semitransparent Cu electrode of a baseline junction cause a partial reduction of the Cu,O substrate into elemental copper, Cuo (see [12]). This obviously modifies the [Cu'] depth profile of the baseline device (Fig.…”
Section: Case Of Native Interfacial Layermentioning
confidence: 99%
“…2 with the depth profiles of constituent elements determined from AES for Cu/Cu,O junctions obtained by H + ion bombardment [ 121 enables us to explain the possible mechanism of the native IL modification (case B). Incident H + ions, especially those belonging to the high energy tail of their spectrum, when passing through a thin semitransparent Cu electrode of a baseline junction cause a partial reduction of the Cu,O substrate into elemental copper, Cuo (see [12]). This obviously modifies the [Cu'] depth profile of the baseline device (Fig.…”
Section: Case Of Native Interfacial Layermentioning
confidence: 99%
“…Many techniques have been used in preparation of Cu 2 O thin films. These include Copper thermal oxidation [17,18], chemical oxidation [19], sol-gel method [20], electro-deposition [21], and gas-phase deposition that includes radio frequency (rf) magnetron or reactive sputtering, vacuum evaporation, molecular beam epitaxy and laser ablation [22]. Among these techniques, sputtering is a versatile and low-cost technique for preparing Cu 2 O thin films [23].…”
Section: Introductionmentioning
confidence: 99%
“…Thin films of polycrystalline Cu 2 O are expected to have many dangling bonds, which act as an interface recombination center on the grain surface. 12,13,[23][24][25] The improvement of the short circuit current density could be a clear signature of reducing interface states and increasing carrier collection efficiency, which is a sign of active passivation while trapping hydrogen and nitrogen between interfaces (Fig. 4(a)).…”
mentioning
confidence: 99%