“…Nowadays, the general physical description of such semiconductor devices with catalytic metal gates based on the metal-insulator interface has been well established [4][5][6][7][8]. Moreover, further developments on the novel dielectric layer have been carried out to substitute the silicon dioxide layer, such as Si 3 N 4 [9], Ta 2 O 5 [9], Al 2 O 3 SiO 2 [4], Al 2 O 3 [10,11], SiO 2 SiC [12,13], SiC [14], ZnO [15], TiO 2 [16], GaAs [17], and diamond thin film [18,19].…”