The influence of copper on the heat resistance of thin foils of high-entropy alloys of the Cr–Fe–Co–Ni–Cu system obtained by the electron beam deposition method

Manufacturing honeycomb panels on the base of high-entropy CoCrFeNiSi0.2 alloy foil produced by EB-PVD method

“…at the temperature of 1000 °c the oxidation kinetics of foil of cocrfenisi 0.2 alloy obeys the parabolic law, which may be indicative of formation of a continuous protective oxide film on the surface. Here, the intensity of increase of the specific weight of CoCrFeNiSi 0.2 foil samples at the temperature of 1000 °c is lower, even compared to foils of hea without silicon at the temperature of 900 °c [9]. that is addition of silicon in the quantity of about 5 wt.% promoted an increase of heat resistance, and also allowed raising the potential service temperature of the material application up to 1000 °c (figure 3, curve 1).…”

“…earlier research established that copper content has an essential influence on the values of heat resistance of Co-Cr-Fe-Ni-Cu system alloys: with lowering of copper content in the alloy composition its heat resistance increases [9]. also in works [11,12] it was shown that alloying of cocrfeni base alloy by a small quantity of silicon may lead to a considerable increase of its heat resistance, as a result of formation of combined scale based on cr 2 O 3 and siO 2 on the alloy surface.…”

“…In the previous works, the authors [6][7][8] showed that the method of high-speed electron beam deposition allows producing thin foils from cocrfenicu hea with a rather wide range of micromechanical characteristics, high damping properties and weldability. It was also shown that at high-temperature resistance testing at the temperature of 900 °c in atmospheric air, foils from cocrfeni alloy demonstrate rather high values of high-temperature resistance due to formation of low-defect continuous scale based on cr 2 O 3 oxide on the surface [9].…”