The influence of alloying elements on metastable NiSn4 in Sn-Ag solders on Ni-containing metallizations

Abstract

Sn-Ag based solders are a popular Pb-free alternative in consumer electronics and have a relatively long history with a large body of dedicated research. Past research has primarily focused on the formation of interfacial intermetallic (IMC) layers and the growth of Sn, and little attention has been paid to Ni-containing IMCs that form in the bulk solder when SnAg alloys are soldered to Ni-containing metallizations. The present study illustrates a new phenomenon: formation of metastable NiSn 4 as a primary and a eutectic phase in solder joints between Sn-Ag solders and Ni-containing surface finishes. The metastable NiSn 4 was demonstrated to transform into Sn and equilibrium Ni 3 Sn 4 IMC phase during ageing at 150°C. Impact shear tests suggested a significant drop in solder joint mechanical response when larger than 2μm NiSn 4 crystals were present in the solder bulk. Further exploration of the influence of alloying elements on metastable NiSn 4 in solder joints yielded three scenarios: (i) Au, Pt, Pd and Co promoted NiSn 4 formation and increased its volume fraction by substituting for Ni atoms in NiSn 4 ; (ii) Bi, In, Fe and Pb additions appeared to have little or no discernible effect on NiSn 4 and (iii) Cu was found to promote equilibrium Ni 3 Sn 4 phase formation that replaces metastable NiSn 4 at Cu levels above 0.3wt%.

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits

“…Consequently, they react with Ni, leading to the formation of various intermetallic compounds (IMCs) such as Ni 3 Sn 4 , Ni 3 Sn 2 , Ni 3 Sn, etc. [25,29,30]. This reaction consumes some Sn atoms in adjacent regions, consequently impeding the diffusion of Pb.…”